Electronics Forum | Mon Jul 08 11:53:40 EDT 2002 | yngwie
Hi Guys, We prints solder paste on via hole as the holes are used as the test points. This is a clean process. In normal production, upon completion of a primary side, board will proceed to secondary process immediately. The problem happened when
Electronics Forum | Wed Aug 07 08:46:38 EDT 2002 | davef
The time and temperature required for baking moisture from your boards varies according to the conflicting desires to: * Remove enough entrapped moisture. * Desire to retain solderability of solderable surfaces. Search the fine SMTnet archives for s
Electronics Forum | Thu Jun 03 21:27:58 EDT 2004 | davef
We know of two "solder savers" 1 Kester Formula 5749 Solder Saver: We believe Kester Formula 5749 Solder Saver to be a new formulation of Kleenox. Kleenox works. It helps separate the solder entrapped in the dross. [One tiny warning, one chemical
Electronics Forum | Thu Sep 02 16:12:51 EDT 2004 | Mike Konrad
Hi -K We are a manufacturer of ionic contamination testers (not yours). In most cases, automatic mode is appropriate. In some instances however, you may need extra time to �release� entrapped contamination from the sample. Automatic mode is not a
Electronics Forum | Thu Sep 16 18:59:14 EDT 2004 | Carol
Thanks Everyone, the information was very useful. We use 7095 as a bible. A-610 6.5.3 doesn't allow for any solder balls not entrapped/attached etc. so we will look again at plugging/tenting both ends of the via. We ran into the problem of the mask
Electronics Forum | Thu Jan 26 17:59:07 EST 2006 | GS
How is RH% inside your Dry Cabinet ? What is the most critical MDL of your MSDs soldered on your board ? Best instructions about Handling of MSD you can get from Standard J-STD-033B/C. The defects you encountered at test it could be moisture absor
Electronics Forum | Wed Feb 08 03:35:58 EST 2006 | GS
100�C) the moisture changes in vapour/gas generating an internal pressure causing in the worst case damages like internal planes delamination, popcorn effects, degassing, ecc. So you can understand why before reflow it could be necessary to backe and
Electronics Forum | Mon Aug 14 18:03:49 EDT 2006 | GS
Sure the bake need to be done after BGA replacement? Normally the board need to be backed before BGA replacement (not only)in order to avoid PCB delamination due to moisture entrapped during his life staing on field. Oven Temperature from 90 to 125
Electronics Forum | Thu Oct 05 10:37:10 EDT 2006 | David
Hello all, We have problem with voids in one of our product. We are soldering IC (package SO8) with under the components grounding connection. The ground pad for this component has 3 via holes (before producing we have to cover this 3 holes from b
Electronics Forum | Thu Nov 30 12:12:14 EST 2006 | pbarton
I am in the process of characterising a new vapour phase reflow system and am interested to learn if anyone out there has ever come across time/temperature datalogging equipment capable of being run through the entire process (including vacuum) along
