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Henkel Chip-on-Board (COB) Encapsulants

Henkel Chip-on-Board (COB) Encapsulants

New Equipment | Materials

Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi

Henkel Electronic Materials

Partner with an Expert to Ensure Wet Process Cleaning Equipment Success

Industry News | 2019-11-27 10:27:07.0

“One-stop” expert consultation can keep semiconductor production on track through installation and beyond

JST Manufacturing

Voiding in CSP Ground pad

Electronics Forum | Wed Feb 05 15:16:15 EST 2003 | davef

If the voiding is not related to entrapped air in your vias, consider trying a different paste.

Solder balls under LLP

Electronics Forum | Sun Aug 28 09:23:52 EDT 2005 | davef

Sara Rice: How did you determine the balls were entrapped?

BGA Pad Cratering

Electronics Forum | Fri Jun 05 17:36:39 EDT 2009 | gsala

what do you think about Moisture entrapped into BGA or PCB before reflow ? regards GSx

intrusive reflow with OA paste

Electronics Forum | Tue May 23 22:23:20 EDT 2000 | JAK

Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e

intrusive reflow with OA paste

Electronics Forum | Tue May 23 22:21:13 EDT 2000 | JAK

Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e

minimum solder ball (bead) size

Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks

IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap

Re: Good Solder Joint Failures

Electronics Forum | Tue Feb 16 12:14:12 EST 1999 | Gregg Reick

| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they

Re: intrusive reflow with OA paste

Electronics Forum | Thu May 25 17:18:45 EDT 2000 | Boca

I have not done pin in paste in production quantites, but speculation is always a blast so; OA fluxes are active at room temperature, they grow 'fur' with humidity if not washed off, great stuff for soldering, nasty stuff for reliability (if not rem


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