Electronics Forum | Sun Nov 28 20:30:51 EST 1999 | Greg H
What are the possible consequences when there's a flux entrapment (location: vias under components)under components during wave soldering? thanks
Electronics Forum | Tue Nov 30 16:50:20 EST 1999 | Dave F
Greg: It depends on the specifics of the flux you are using. You didn�t say. Generally, using a: � "No-clean flux" should create no flux entrapment problems for most applications. � RMA with 25% or more solids as a "no-clean" should create no flu
Electronics Forum | Tue Aug 14 15:45:06 EDT 2001 | davef
BOARD BAKING SCHEDULE: Bake time depends on the board thickness and construction. For laminated FR4 PCB, we bake between 6 and 24 hours at 100�C. ROOT CAUSE OF THE PROBLEM: Heating moisture entrapped between the laminations of the board too quickl
Electronics Forum | Wed Feb 26 10:57:47 EST 2003 | larryk
Dave, I had to contact Circuits Assembly, but I got the article. I'm going to forward it on to Ryan. I think you're on to his problem with flux becoming entrapped in the epoxy. It plays along with Locktites suggestion of a longer soak on his profile.
Electronics Forum | Thu Aug 05 20:42:11 EDT 2004 | Andrew
If the moisture does not has path to escape,what will happen to the entrapped moisture ,will there be a problem in the asssembly process?
Electronics Forum | Thu Aug 05 21:20:40 EDT 2004 | davef
The entrapped moisture WILL escape. You just want to assure it is not through your PTH and via. Hopefully your board is constructed such that the alternate escape path for the moisture does not delaminate the board.
Electronics Forum | Mon Aug 29 13:05:11 EDT 2005 | solderguy
Hi All, In IPC-A-610 there is a definition for what constitutes "Entrapped/encapsulated/attached" on page 5-14 in the note. It says that it means that the ball will not be dislodged in the normal service environment of the product. Jim Jenkins
Electronics Forum | Tue Aug 15 19:07:13 EDT 2006 | vlad_uk
With the added temperature peak associated to Lead free reflow is anyone seeing or concerned about the increased vapor pressure that may result from moisture entrapment in moisture sensitive components?
Electronics Forum | Tue Jan 06 14:37:27 EST 2009 | stevek
The easiest way to prove out the absorbtion theory is to weigh the parts before wash, after wash, and after baking. You probably want to do this with the bare parts in isolation as the fab will pick up considerable moisture. Differences in weight s
Electronics Forum | Mon Jan 12 02:56:42 EST 2009 | sachu_70
Hi Bill, You should try pre-baking any such old devices prior to using on SMT Reflow. Refering to MSL-type3 guidelines could help in your case.
