Electronics Forum | Mon Feb 22 22:25:19 EST 2021 | rowan
Hi, We were having flux residue entrapment under the component. So we are evaluating to add steam cleaning with DI water, using precision micro prior to Di wash. Have anyone tried this and what are pros and cons. Your advice appreciated. Thanks
Electronics Forum | Thu Nov 30 21:30:00 EST 2023 | ritronusa
Having issues with getting the right formula for a GPD simplecoat machine. We tried a silicone that hardened in our lines and when we try acrylic it is either showing air entrapment or cobwebbing.
Electronics Forum | Tue Jul 06 13:02:41 EDT 1999 | John Thorup
| | I've heard that use of VOC free flux with wavesolder fixtures can be challenging due to entrapment of water in the fixture. | | | | Is anyone out there successfully running VOC free with wave fixtures & did you experience problems? If so, how d
Electronics Forum | Thu Jul 09 11:20:24 EDT 1998 | Justin Medernach
| I am looking for a little enlightement with an issue that we have been seeing. We have printed curcuit board with multilayer and HAL finished. | After reflow soldering, we have often "blister phenomenon". | Our reflow profile is normal. Factory
Electronics Forum | Sat Jun 13 11:00:21 EDT 1998 | Earl Moon
| We are very concerned about outgassing in wavesoldering. | If anyone knows how to use properly well pcb's before soldering in order to avoid this problem please let me know. I have this problem in FR4 large double sided pcb's. My soldering line is
Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs
I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle
Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef
Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as
Electronics Forum | Fri Jun 29 14:13:05 EDT 2001 | markhoch
Just a quick thought on solder balls "or beads" caused when using NC paste. I found a spec (12.4.10 in IPC-A-610C) that says solder beads are acceptable if they are entrapped in NC flux residue and can not be dislodged in the normal service environme
Electronics Forum | Mon Oct 18 11:48:57 EDT 1999 | Dave F
No, but answer me this? 1 What type of BGA? 2 What's the wave process, materials and temps? Are you waving the BGA or top-side flowing it? 3 If the BGA is plastic, what are you doing to prevent/remove entrapped moisture before solder processing?
Electronics Forum | Tue Jul 06 12:21:38 EDT 1999 | Kelly Morris
I've heard that use of VOC free flux with wavesolder fixtures can be challenging due to entrapment of water in the fixture. Is anyone out there successfully running VOC free with wave fixtures & did you experience problems? If so, how did you resol
