New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
using our splice tape for SMT, which guarantee perfect and reliable joints in punched carrier tapes without shutting off the machine 1)high efficiency 2)reducing SMT machine and feeder abrasion: 3)energy saving 4)make full use of component in the car
Electronics Forum | Thu Sep 02 16:12:51 EDT 2004 | Mike Konrad
Hi -K We are a manufacturer of ionic contamination testers (not yours). In most cases, automatic mode is appropriate. In some instances however, you may need extra time to �release� entrapped contamination from the sample. Automatic mode is not a
Electronics Forum | Fri Jan 21 16:50:33 EST 2005 | Board House
I work for a board house and our proceedure for this process is the following, We cover the via pads leaving the hole open and then apply the surface finish and then go back and Cover the Via with a second operation. By doing this you do not entrap
Industry News | 2019-10-22 10:38:18.0
Versatile and Effective Swabs for Many Applications ACL Staticide® introduces critical cleaning dry swabs to its contamination control product line. These high quality critical cleaning swabs are economical and can be used in hard-to-reach areas. Each style offers a unique property to suit a specific cleaning option.
Industry News | 2010-11-08 21:18:56.0
Techcon Systems introduces its new Rigid TT Series Dispensing Tips. The new rigid tips are designed to provide accurate positioning for automation dispensing applications.
Technical Library | 2023-04-17 21:17:59.0
The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry practice for ionic contamination detection limits. Design/methodology/approach – PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide results capable of differentiating different sensitivity levels for each test. Findings – This study provides an understanding of current industry practice for ionic contamination detection using verification tests with different detection sensitivity levels. Some of the available cleanliness monitoring systems, particularly at critical areas of circuitry that are prone to product failure and residue entrapment, may have been overlooked. Research limitations/implications – Only Sn/Pb, clean type flux residue was evaluated. Thus, the current study was not an all encompassing project that is representative of other chemistry-based flux residues. Practical implications – The paper provides a reference that can be used to determine the most suitable and effective verification test for the detection of ionic contamination on PCBAs. Originality/value – Flux residue-related problems have long existed in the industry. The findings presented in this paper give a basic understanding to PCBA manufacturers when they are trying to choose the most suitable and effective verification test for the detection of ionic contamination on their products. Hence, the negative impact of flux residue on the respective product's long-term reliability and performance can be minimized and monitored effectively.
