Parts & Supplies | Pick and Place/Feeders
KHY-M221A-A0 KGT-M221A-A0 YAMAHA YG12 tank chain gland KHY-M2267-00 YG12 tank chain YS12 towline keel X axis PISCO SP2550 R75 KHY-M2276-S0 YS12 screw X-axis YG12 X-axis screw YG12F YS12F screw guide KHY-M371R-00 RAIL GUIDE 12P YS24 YS100 Feida pl
Technical Library | 2019-05-24 09:22:59.0
There is a smaller process window and a much narrower margin of error when creating and using lead-free reflow profiles for surface mount parts on printed circuit boards (PCBs). Solder balls, dewetting, tombstones, voids, and head-on-pillow problems will occur much more frequently because lead-free alloys behave differently than eutectic pastes. Problems are compounded due to the extra heat necessary for some lead-free pastes to reach their melting points.
SMT Lead Free Wave Soldering Machine XMW-350 Wave soldering advantages: ▶Comprehensive: economical and power-saving type is suitable for various lead-free and lead-free processes. Intelligent: intelligent control software, memory process parameters
Industry News | 2010-08-04 21:04:22.0
Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.
New Equipment | Rework & Repair Services
On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and product research and developers. Specializing in quick turn around times to help get your product to market on time. Training Serv
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! Easy placement and Soldering of BGAs, CGA's, CSPs, QFPs, LGA's and Other SMD's using this BGA Rework Station with color optical system that h
SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri
SMT Lead Free Wave Soldering Machine XMW-450 Feature ▶Comprehensive: economical and power-saving type is suitable for various lead-free and lead-free processes Intelligent: intelligent control software, memory process parameters, automatic heating
DIP Double-side Camera Online AOI Machine ETA-V5300 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac
Technical Library | 2019-10-21 09:58:50.0
An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).
