Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
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New Equipment | Rework & Repair Equipment
Shutte Star SV-560A Automatic bga rework machine soldering desoldering station bga rework station printed circuit board repair Features: 1. Hot air heater head and mounting head are designed 2 in 1, with auto pick-up,auto solder,auto desolder a
New Equipment | Rework & Repair Equipment
Hot selling optical motherboard BGA chip rework station for laptop/mobile PCBA chip soldering and desoldering Features: 1.Hot air heater head and mounting head are designed 2 in 1, driven by step electric motor, have both the auto soldering a
New Equipment | Rework & Repair Equipment
Automatic bga rework machine soldering desoldering station bga rework station board repair Features: 1. Hot air heater head and mounting head are designed 2 in 1, with auto pick-up,auto solder,auto desolder and auto placement function. 2. Th
New Equipment | Cleaning Equipment
Fully automatic stencil cleaning system MLPBT-750 Application fields of "MLPBT-750 steel mesh cleaning machine": ●Suitable for cleaning various types of stencils such as steel mesh, copper mesh, microporous mesh, and wafer tray [see the following fi
Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
Technical Library | 2019-06-12 10:33:58.0
The success of ball grid array (BGA) placement on electronic assemblies is as much a matter of proper preparation and planning, as it is technique. In some designs, it is more appropriate to apply BGAs using a rework station that isolates the placement of the device, without subjecting the entire assembly to thermal reflow. This is especially beneficial in board constructions where the number of BGAs is limited, and the application of the solder paste is difficult, due to small pitch features that stretch the limitation of the stencil construction. Another application for rework stations, involves very large and thermally conductive BGAs, which will not uniformly reflow with other components on the assembly, and may require special process parameters for their proper placement. The most common use of BGA rework stations are for assemblies requiring BGA removal and replacements due to failures in the initial assembly stage.
Fully automatic stencil cleaning system MLPBT-750 Application fields of "MLPBT-750 steel mesh cleaning machine": ●Suitable for cleaning various types of stencils such as steel mesh, copper mesh, microporous mesh, and wafer tray [see the following fi
Industry News | 2009-06-11 12:25:44.0
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