Electronics Forum | Mon Nov 09 07:21:02 EST 2009 | CL
Good Morning, I have seen many posts regarding BGA voiding being excessive and what can be done to better the condition. I have a customer that has an assembly that we have had a diufficult time with. We have spent a lot of time debugging the proces
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Electronics Forum | Wed Jan 21 22:35:01 EST 1998 | Scott
| Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Quad Flat Pack) device in a reflow oven? We recently used a CY7C375i in a TQFP160 package and we experienced warping (bending) of this c
Electronics Forum | Thu Jan 29 08:33:34 EST 1998 | Mike Moninger
| This is a re-post of my previous message. I typed my Email address wrong in the other message. I am sorry for any inconvenience caused. | Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thi
Electronics Forum | Tue Jan 20 13:33:14 EST 1998 | Justin Medernach
| This is a re-post of my previous message. I typed my Email address wrong in the other message. I am sorry for any inconvenience caused. | Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thi
Electronics Forum | Fri Jan 29 15:39:04 EST 1999 | Chris Jackson
I have a recent design (1 component side only) that calls for 2 surface mounted antenna's (brass plated) to be mounted on a PCB. The problem arises when the PCB is 18x11.25 and has 15 to 20 PCB's in the pallet (IE weight, fixturing to hold the anten
Electronics Forum | Wed Oct 07 06:19:30 EDT 1998 | Charles Stringer
| | | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medi
Electronics Forum | Fri Oct 22 07:31:24 EDT 2004 | davef
We're unclear about what you're seeking, but in order to move the conversation along, are you looking for: IPC-SM-782A - Surface Mount Design & Land Pattern Standard ANSI Approved Get up-to-date land pattern recommendations for ball grid array pac
Electronics Forum | Sun Oct 03 21:36:57 EDT 1999 | JAX
| What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | How about curing bottom side first and reflowing top side later? | | What percentage of companies run reflow/cur
