Full Site - : epibond reflow problem for melf components (Page 7 of 11)

Optimal Speed for Universal Chip Shooters

Electronics Forum | Wed Jun 11 16:30:33 EDT 2003 | T.Vick

You have received some great feedback so far. I would like to summarize and add a few points regarding maintenance. You should start (as recommended already) by verifying your component library data. Using the default values from the master library i

Re: Screen printing glue for wave soldering SMT components.

Electronics Forum | Fri May 26 05:54:40 EDT 2000 | Sal

For the past year now we have been printing adhesive with no real problems. Our printing ranges from 0603's to SOIC using a variation of aperture sizes and metal thickness foils. The crucial parameters are : aperture sizes : These obviously depend o

Re: How to do with tombstoning for component '0402'

Electronics Forum | Mon Nov 06 14:21:09 EST 2000 | Kevin

Masking thickness can also play a factor in tombstoning (or the Manhattan Effect). If the pad is 2 mils or more below the surface of the masking this can create a problem. Depending on the thickness of the solderpaste deposition, the solder height

Recommended TG material for CCBGA , CBGA and PBGA's

Electronics Forum | Sat Mar 01 08:17:40 EST 2003 | davef

You're correct that the FR4 is probably the best choise. The majority of the problems in developing your reflow recipe is going to come from the CTE mismatches in the CCBGA , CBGA and PBGA that you put on the board. The other side says given the pr

Which side of PCB should be prefered for screening...

Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake

Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas

BGA Solder joint appearance for the Motorola 860

Electronics Forum | Mon Jan 07 20:31:15 EST 2002 | davef

While not a Motorola 860 BGA user, we see that on other components. In fact, some of the ErsaScope adverts show the effect. WHAT CAUSES THIS? Generally, the design / layout of the interposer has been the cause of this appearance. IS THIS A CONCER

What are the best profiles for 3 zone ersa reflow?

Electronics Forum | Fri Mar 27 10:04:51 EDT 2009 | ericthered

We have been having problems with proper wetting when running mainly lead free but also leaded solder in our Ersa Hotflow 3. Solder either often looks grainy or doesn't flow over the whole pad. This is generally the case when my profile is 170 firs

Need low cost pick and place machine for limited production

Electronics Forum | Mon Aug 10 15:15:17 EDT 2009 | indity

I have very little knowledge of pick and place machines or assembly, and was hoping someone could give me some advice of where to start looking. I do learn quickly so I am not afraid of challenges or learning through mistakes. I need to produce abou


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