This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Technical Library | 2023-08-16 18:48:50.0
One of our aerospace customers was looking to automate a few manual operations and asked for suggestions. This customer specializes in assemblies for inflight connectivity for commercial airlines and low orbit satellites. The dispensing process included the application of bonding to the sides of large and small components (4-axis) and the ability to cope with the changing viscosity during processing. The material used was EC-2216 B/A Two Part Epoxy and the largest board size was 12"x10"
Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
Technical Library | 2024-03-19 15:53:34.0
Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board.
Technical Library | 2023-08-16 18:20:44.0
One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.
Industry Directory | Manufacturer
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Industry News | 2011-01-12 17:48:44.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.
Industry News | 2011-02-04 01:47:14.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing at the upcoming SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX.
