D&H offers an automatic dosing machine for degassing, proportioning, mixing and high precision dosing of two component resins (epoxy, polyurethane, silicone..) in the atmospheric environment. Model:JYPJ-1000 JYPJ-1000 system accurately meters, m
Used SMT Equipment | Adhesive Dispensers
The CAM/ALOT 5000 Liquid dispensing system provides hign-speed adhesive or solder paste dispensing for applications involving large boards or multi-up panels: ● 25,000 dots per hour for 50 mil pitch solder paste ● 22,000 dots per hour for 3mm pi
About the machine please contact whatsapp 0086 134 2516 4065 D&H offers an automatic dosing machine for degassing, proportioning, mixing and high precision dosing of two component resins (epoxy, polyurethane, silicone..) in the atmospheric enviro
Used SMT Equipment | Adhesive Dispensers
Vision System for programming & fudicial correction Pass thru Conveyor 115V, 60Hz, 10Amps Computer controlled (teach-mode) Auto correction. The CAM/ALOT 5000 System provides high-speed adhesive or solder paste dispensing for applications
Industry Directory | Manufacturer / Other
We are based in Singapore and in the US and we are a worldwide distributor of Paper Lead frame & Boardframe for mold cleaning and dummy molding.
More Product Information: EN: http://www.essemtec.com/en/products/dispensing/tarantula/ DE: http://www.essemtec.com/produkte/smt-dosieren/tarantula/ Introducing - The Tarantula - State of the art technology, easily integrated in any line. Wide range
Dispensing Equipment for Small Batches and Rework Micro dispensing for small batches and rework. Precisely dispense solder paste, epoxy and underfill with the highest consistency, even for the smallest dots. For 25 years MARTIN have been setting
The CAM/ALOT 5000 Liquid dispensing system provides hign-speed adhesive or solder paste dispensing for applications involving large boards or multi-up panels: ● 25,000 dots per hour for 50 mil pitch solder paste ● 22,000 dots per hour for 3mm pi
Whatsapp 0086 134 2516 4065 Model:PGB-200 PGB-200 system accurately meters, mixes and dispenses two-component medium to low-viscosity materials for potting, gasketing,sealing, encapsulation and syringe filling. For variable ratio dispensing, the
Technical Library | 2017-08-17 12:23:27.0
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies.
