Whatsapp +86 134 2516 4065 PGB-1200 2 part epoxy silicone polyurethane auto glue potting machine epoxy resin dispensing machine AB compound pouring machine Model:PGB-1200 PGB-1200 system accurat
Whatsapp +86 134 2516 4065 Model:PGB-1500 PGB-1500 system accurately meters, mixes and dispenses two-component medium to low-viscosity materials for potting, gasketing,sealing, encapsulation and syringe filling. For variable ratio dispensing, the
epoxy resin meter mix and dispensing machine for Current and Voltage Sensors Whatsapp +86 134 2516 4065 Model: PGB-200 PGB-200-800 system accurately meters, mixes and dispenses two-compon
Full automatic model with 3 axis bi-component potting compound dosing and dispensing machine, whatsapp(0086 134 2516 4065) PGB-700 system accurately meters, mixes and dispenses two-component medium to low-viscosity materials for potting, gasketing,
Technical Library | 2022-01-26 15:26:56.0
In this work an attempt is made to improve the fracture toughness and electrical conductivity of epoxy/glass fiber based laminates by the inclusion of carbon nanotube (CNT) fillers. The fiber orientation of the epoxy/ glass fiber (GF) fabric laminates was optimized based on estimation of mechanical properties. The carboxylic acid functionalized CNTs were incorporated into epoxy matrix by ultra-sonication method. The nano filled epoxy resin was used to prepare laminates with 30/45 GF fabric orientation. The CNT content was varied and its effect on the tensile properties was determined. The fracture toughness of multiphase composites was estimated using single edge notch bend (SENB) test. The presence of CNTs improved the fracture toughness by a crack bridging mechanism. The volume resistivity of multiphase composites was found to be superior to the conventional epoxy/CNT composite. The presence of glass fabric reduces the number of inter-tube contacts contributing to the reduction in volume resistivity.
Technical Library | 2015-12-23 16:57:27.0
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.
More Product Information: EN: http://www.essemtec.com/en/products/dispensing/tarantula/ DE: http://www.essemtec.com/produkte/smt-dosieren/tarantula/ Introducing - The Tarantula - State of the art technology, easily integrated in any line. Wide range
Innovative Materials, Superior Performance. Our printed circuit board and semiconductor packaging materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS complian
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
