Electronics Forum | Tue Jan 25 13:15:17 EST 2000 | Michael Allen
Thanks for the input Mike (and others). As you guessed, via-in-pad is not my idea, and I'm resisting it as much as I can. One of our designers used this practice at some other company, says there were no problems, and wants to use it (via-in-pad) a
Electronics Forum | Wed Dec 18 10:10:07 EST 2002 | davef
No, sorry not on "Dave's Bookshelf". My basis is a study done at IBM. I reference it here: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=4941&#Message19050 Responding differently, you're correct. If you have a
Electronics Forum | Tue Jul 27 17:54:37 EDT 1999 | Earl Moon
| | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | 12BGA per assembly | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | Pads .014inch | | | | | Vias within footprint .020inch | | | | | Vias to
Electronics Forum | Thu Jul 29 11:34:27 EDT 1999 | Justin Medernach
| | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | 12BGA per assembly | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | Pads .014inch | | | | | | Vias within footprint .020inch | | |
Electronics Forum | Thu Jul 29 15:29:30 EDT 1999 | Earl Moon
| | | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | | 12BGA per assembly | | | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | | Pads .014inch | | | | | | | Vias within footprint .02
Electronics Forum | Fri Apr 12 17:22:47 EDT 2002 | davef
First, splitting hairs on parlance. * Conformal Coating. A thin electrically nonconductive protective coating that conforms to the configuration of the covered assembly to provide environmental and mechanical protection. * Solder Mask. Coating mate
Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
Electronics Forum | Tue Apr 01 09:58:52 EST 2003 | davef
You're entirely correct. The gold is most likely gone away. [Don't forget you can check if the surface is still solderable with a hand soldering iron.] We're not sure it it will give you the results you seek, but consider using a dye penetrant fai
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
Electronics Forum | Sat Oct 02 03:27:52 EDT 1999 | Brian
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
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