Electronics Forum | Fri Sep 11 17:23:00 EDT 1998 | Eric Miller
Hey Dave, sounds like your material is delaminating at a rapid rate, I would not recommend using them through your process, delaminating material has to go some where! When composite material is made, layers of fibre glass and epoxy resin are placed
Electronics Forum | Tue Apr 07 14:37:14 EDT 1998 | Chrys
Be careful about the material you choose. All the materials out there are basically glass-filled epoxy composites, but they are different blends with different fillers. Some of them have carbon in the matrix to make them ESD safe, but it also short
Electronics Forum | Tue Sep 15 10:43:25 EDT 1998 | dave c
| Dave, | Sounds like you have material issues. Been there, done that. Tried 'em all. The best, longest lasting material I've found is called Durostone. It's made by a Roeschling, and most of the big fixture cutting houses now offer it as an option
Electronics Forum | Mon Mar 27 20:52:22 EST 2000 | Dave F
Marc: In printed circuit board fabrication, fabricators place sheets of prepreg between each pair of glass cores. They stack these layers into books. As they heat and press the books, the sheet melts into an epoxy glue. The thickness of the prepr
Electronics Forum | Mon Aug 16 04:34:54 EDT 1999 | Earl Moon
| | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with
Electronics Forum | Mon Aug 16 04:47:04 EDT 1999 | Charles Stringer
| | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact wit
Electronics Forum | Sat Mar 29 08:38:28 EST 2003 | davef
Iman When you talk about your profile, can we assume you're measuring it on the pads of LGA? Profile the solder paste reflow by placing a thermal couple under the component pad, similar to a BGA. On a slight tangent, as with soldering BGA, paste
Electronics Forum | Sat Sep 25 07:07:02 EDT 1999 | Brian
| I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? | There are several different mechanisms which can cause this. In reality, ionic contamination is the root cause for many of the
Electronics Forum | Tue Nov 09 10:44:29 EST 2004 | stefwitt
If you are doing small circuits, you could use glass slides http://www.hometrainingtools.com/catalog/microscopes-accessories/cat_microscope-slides.html apply conductive epoxy traces, place your components in it and cure at ~ 120 Degree C
Electronics Forum | Mon Feb 05 17:18:53 EST 2001 | davef
Wha, Nellie!!! Delamination & Blistering IPC-A-600D Although it may occasionally occur because of a severe process breakdown, delamination and blistering occurs as a result of an inherent weakness of the material. Either condition represents a brea
