Industry News | 2022-06-24 10:13:15.0
SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.
World’s first water-based cleaning agent for the removal of conformal coating material from pallets, fixtures, and tools ATRON® DC is engineered specifically for maximum decoating power while prioritizing the highest level of operator safety. It is
Poor handling procedures may sometimes damage corners and edges on printed circuit boards. Most of these types of damage to PCB's can be repaired using the BEST Board Repair Kit. This versatile repair kit along with our clear "how to" instructions of
Industry News | 2021-02-24 11:47:14.0
YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.
TianHao company offer a full range of fluid dispensing equipment and consumable that provide the quality results you demand. and Complete robotic dispensing solutions and high precision systems.
A brief demonstration of the ScanCAD Precision Material Removal System for PCB Reverse Engineering
Industry Directory | Manufacturer
Since 1984 SJE has been supplying manufacturers with a comprehensive line of ERC High Precision Capacitors and Aluminum Electrolytic Capacitors for all types of applications.
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
6 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
Technical Library | 2014-06-02 11:03:45.0
With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.
