Industry News | 2015-09-10 17:02:54.0
Ventec Europe will present a paper entitled 'Making the right decisions at the right time in the PCB design process' at the 2015 SMART Group European Conference & Exhibition. The conference will be held on the 22-23rd September at the National Physical Laboratory (NPL), one of the UK’s leading science and research facilities, located in Teddington, London.
Industry News | 2014-08-12 13:50:53.0
Indium Corporation's Wisdom Qu, assistant technical manager, and Fengying Zhou, research chemist, will present at the SMTA China South Conference Aug. 26-28 in Shenzhen, China.
Industry News | 2018-02-14 10:15:17.0
Press Release YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA
Technical Library | 2016-11-17 14:37:41.0
With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.
Industry News | 2012-06-05 15:47:34.0
Engineered Material Systems introduces 535-10M-1 UV Cured Adhesive formulated for disk drive camera module, optoelectronic and circuit assembly applications.
Technical Library | 2015-09-10 15:06:17.0
A new non-halogen flame retardant has been developed and is useful for a variety of high performance applications. This non-reactive phosphorus-based material satisfies fire safety needs for a broad range of resins including epoxy, polyolefin, and polyamide. The combination of excellent flame retardant efficiency, high thermal stability and exceptional electrical properties is unique to this organophosphorus flame retardant and makes it a breakthrough technology for high speed, high frequency use in fast growing wireless and wired infrastructures. Resin performance data, including formulations with synergists, are presented in this paper.
Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package
New Equipment | Assembly Services
• Material: neodymium iron boron • Properties: high coercive force, the maximum working temperature is up to 200°C • Grades: N35 to N52, 33M to 48M, 33H to 48H, 30SH to 45SH, 30UH to 38UH and 30EH to 35EH • Shapes and size: disc, block, ring and s
Industry Directory | Manufacturer
We are manufacturer of 2K potting technology AB glue dispensing machine Epoxy dispensing machine Two-component dispensing machine，Dual-component dispensing machine Meter-mix dispensing machine，Resin dispensing machine
4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
