Full Site - : epoxy high (Page 19 of 55)

Krayden, Inc. Introduces Expanded New Line Card for 2009

Industry News | 2009-04-08 16:12:41.0

DENVER � April 2009 � Krayden, Inc., a leading distributor of engineered materials, introduces an updated and expanded line card, detailing its services and manufacturers.

Krayden Inc.

AG-800 Silver Conductive Ink  for High-Speed Screen Printing

AG-800 Silver Conductive Ink for High-Speed Screen Printing

New Equipment | Materials

Silver Filled, Electrically Conductive Ink for Screen Printing AG-800 is a unique, electrically conductive silver filled ink designed for high-speed screen printing in flex circuit, membrane switch, and other additive circuit applications. AG-800 i

Conductive Compounds, Inc.

Palomar Introduces New Automatic

Industry News | 2003-05-05 09:13:55.0

Reliable Wire Bonders for High Yield Production

Palomar Technologies

Virtual Panel Tooling

Virtual Panel Tooling

New Equipment | Software

Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate

ASM Assembly Systems (DEK)

Secondary Insulation Materials

Secondary Insulation Materials

New Equipment | Materials

The best stability under all operating conditions is achieved by electrical rotary equipment (motors and generators) and static electrical equipment (transformers and sensors) if all the air trapped inside the wire windings is replaced with insulatio

ELANTAS Electrical Insulation

UV-3010 UV Curable Conformal Coating / Encapsulant

UV-3010 UV Curable Conformal Coating / Encapsulant

New Equipment | Materials

Specifically engineered for water resistance on printed circuit board protection and LED component protection in membrane switches. Surface Resistivity: 3.8 x 1014 ω/■ Insulation resistance of cured films of UV-3010 at 100°C and 95% relative h

Conductive Compounds, Inc.

SHENMAO to Showcase Advanced Automotive Electronic Solutions at 2024 IPC APEX EXPO

Industry News | 2024-03-18 12:35:19.0

SHENMAO Technology will exhibit its cutting-edge solutions for automotive electronics at Booth 2639 during the upcoming IPC APEX EXPO 2024. Taking place April 9-11, 2024 at the Anaheim Convention Center in California, the expo will provide an opportunity for industry professionals to explore SHENMAO's latest advancements in solder paste technology.

Shenmao Technology Inc.

CAMALOT MicroDot Dispensing System

Industry News | 2003-04-07 13:08:13.0

Cookson Electronics Equipment Announces Camalot XYFLEXPRO Microdot Dispensing Capabilities

Phoenix United Associates, Inc.

World-class Dispensing in a Small Footprint

Industry News | 2020-06-11 06:23:00.0

Essemtec announces that its Spider smart-sized high-speed dispenser can be adapted for a wide range of dispensing applications including solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.

ESSEMTEC AG

World's First Commercially Available Diamond Filled Underfill: SMT 158D8

Industry News | 2021-01-21 09:42:44.0

YINCAE is excited to announce that we have developed SMT 158D8 a high thermal conductive underfill that is capillary and fast-flowing, and an easy reworkable liquid epoxy.

YINCAE Advanced Materials, LLC.


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