Full Site - : epoxy high (Page 9 of 55)

SMTA Mexico Expo 2019

Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico

SMTA Mexico Expo 2019

YINCAE Advanced Materials, LLC.

SMTA Mexico Expo 2019

Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico

SMTA Mexico Expo 2019

YINCAE Advanced Materials, LLC.

Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards

Technical Library | 2012-11-01 20:54:49.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. The continuous progression toward portable, high frequency microelectronic systems has placed high demands on material performance, notably low dielectric constants (Dk), low loss tangent (Df), low moisture uptake, and good thermal stability. Epoxy resins are the workhorses of the electronic industry. Significant performance enhancements have been obtained through the use of PPE telechelic macromonomers with epoxy resins. However, there is a ceiling on the performance obtainable from epoxy-based resins. Therefore, non-epoxy based dielectric materials are used to fulfill the need for higher performance.

SABIC

Vimic Electronic Corporation

Industry Directory | Manufacturer

Vimic is expert in the design and manufacture of various types of fluid dispensing tools and a selection of Die Bonding Tools for customized applications. The offering includes Epoxy Stamping Tools, Pick-up Tools, Push up Needles.

PCB & Semiconductor Packaging Materials.

PCB & Semiconductor Packaging Materials.

New Equipment | Materials

Innovative Materials, Superior Performance. Our printed circuit board and semiconductor packaging materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS complian

i3 Electronics

Engineered Material Systems Debuts New 535-10M UV Cure Adhesive for Disk Drive Applications

Industry News | 2012-04-03 13:11:46.0

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, introduces its 535-10M UV Cured Epoxy formulated for disk drive, camera module, optoelectronics and circuit assembly applications.

EMS TECHNOLOGY, INC.

Automated Fluid Dispensing for Epoxy

Technical Library | 2015-06-30 16:07:12.0

Robotics for automated fluid dispensing have the ability to apply a variety of materials including epoxy, silicone, and acrylic coatings. These materials are extensively used in today’s high-speed fluid dispensers for the electronics industry. Whether a dispenser is applying epoxy or another material, the central concept for applying any form of material remains the same. Specific points of an item being dispensed onto are programmed into the dispensing system. The automated fluid dispensers software interprets the programmed information and keeps the travel path in memory. A robotic arm moves fluid dispensing nozzles along this travel path and applies epoxy onto the surface of the item with precise accuracy. Machine speed can be adjusted to emit varying amounts of epoxy. The overall application process is auto-regulating and will not be disrupted.

ETS - Energy Technology Systems, Inc.

Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

Technical Library | 2020-01-09 00:00:30.0

PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.

Polymer Competence Center Leoben GmbH

tianhao dispensing machine TH-2004L2

tianhao dispensing machine TH-2004L2

Used SMT Equipment | Adhesive Dispensers

Features    1. Uses the high accuracy timing control electric circuit to guarantee dispensing evenly.     2. .Have vacuum  Suck-back ensures no dripping.    3. Operation simple, Adjustment and replacement mold is easily. 4. Based on the size of oval

cixi tianhao dispensing equipment co.,ltd

Link 2 Manufacturing Inc.

Industry Directory |

Consigned and Turnkey solutions for Contract Electronic Manufacturing


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