Industry Directory: epoxy via (2)

Titan PCB

Industry Directory |

High Tech, Quick Turn, Manufacturer of PCB's up to 44 layer count. Specializing in Prototype and R&D. Mil-Spec 31032 & 55110 Certified. Located in Fremont, CA & Amesbury, MA.

NCL REPAIR

Industry Directory | Manufacturer

PCB Repairs of all kinds including-Solder on Tab (Solder Removal, Gold Plating), PTH & Delam repairs, etc.

New SMT Equipment: epoxy via (5)

ALUMINUM PROTOTYPE CASTINGS

ALUMINUM PROTOTYPE CASTINGS

New Equipment |  

HARNESSING THE LATEST RAPID PROTOTYPING TECHNOLOGY Prototype Castings / Rapid Prototyping using the following methods: Stereolithography (SLA) Produces models from epoxy resin via a UV laser, directly from CAD data file. Quickcast 3D Systems.

Nu-Cast, Inc. - Aluminum Investment Castings.

RF / microwave printed circuits

New Equipment |  

Using all PTFE, Thermoset and other high performance materials, including epoxy / PTFE hybrids, edge plating and copper sealed vias.

Metro Circuits, div. of PJC Technologies, Inc.

Electronics Forum: epoxy via (52)

conductive fill via

Electronics Forum | Mon Nov 11 11:28:32 EST 2002 | davef

Sand is not a great conductor, compared to copper. Never heard of using the stuff on RF boards. Our board fabricator uses Dupont CP100, now CP101, [or something like that cuse who's going to check?] when plugging via on cheap boards. Your board fa

Re: via hole plugging

Electronics Forum | Wed May 19 13:13:20 EDT 1999 | Dave F

| We care currently running into problems during our plug via process: | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is

Used SMT Equipment: epoxy via (1)

Aqueous Technologies SMT-800-LD Batch Wash

Aqueous Technologies SMT-800-LD Batch Wash

Used SMT Equipment | Board Cleaners

Automatic Wash + Rinse + Cleanliness Test + Dry + SPC Lead Free Ready The SMT Series Cleaning Systems include the industry's most powerful batch-format drying system.  The SMT series cleaners utilize a combination of convection and radiant heat t

Capital Equipment Exchange

Industry News: epoxy via (39)

GPD Global to Focus on PCD Dispensing at ATX West 2011

Industry News | 2011-01-12 17:48:44.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.

GPD Global

GPD Global to Promote PCD Dispensing at the SMTA Dallas Expo & Tech Forum

Industry News | 2011-02-04 01:47:14.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing at the upcoming SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX.

GPD Global

Technical Library: epoxy via (2)

PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks

Technical Library | 2015-12-23 16:57:27.0

The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.

Raytheon

Conductive Anodic Filament Failure: A Materials Perspective

Technical Library | 2023-03-16 18:51:43.0

Conductive anodic filament (CAF) formation was first reported in 1976.1 This electrochemical failure mode of electronic substrates involves the growth of a copper containing filament subsurface along the epoxy-glass interface, from anode to cathode. Despite the projected lifetime reduction due to CAF, field failures were not identified in the 1980s. Recently, however, field failures of critical equipment have been reported.2 A thorough understanding of the nature of CAF is needed in order to prevent this catastrophic failure from affecting electronic assemblies in the future. Such an understanding requires a comprehensive evaluation of the factors that enhance CAF formation. These factors can be grouped into two types: (1) internal variables and (2) external influences. Internal variables include the composition of the circuit board material, and the conductor metallization and configuration (i.e. via to via, via to surface conductor or surface conductors to surface conductors). External influences can be due to (1) production and (2) storage and use. During production, the flux or hot air solder leveling (HASL) fluid choice, number and severity of temperature cycles, and the method of cleaning may influence CAF resistance. During storage and use, the principal concern is moisture uptake resulting from the ambient humidity. This paper will report on the relationship between these various factors and the formation of CAF. Specifically, we will explore the influences of printed wiring board (PWB) substrate choice as well as the influence of the soldering flux and HASL fluid choices. Due to the ever-increasing circuit density of electronic assemblies, CAF field failures are expected to increase unless careful attention is focused on material and processing choices.

Georgia Institute of Technology

Videos: epoxy via (11)

Teaching video on PCB through hole repair. BEST instructors teach the method for repair of a damaged eyelet using a multitude of different close up and angled views.

Teaching video on PCB through hole repair. BEST instructors teach the method for repair of a damaged eyelet using a multitude of different close up and angled views.

Videos

Teaching video on PCB through hole repair. BEST instructors teach the method for repair of a damaged eyelet using a multitude of different close up and angled views. Repair is completed per the IPC 7721 instructions. http://www.solder.net

BEST Inc.

PGB-1200 2 part epoxy silicone polyurethane auto glue potting machine epoxy resin dispensing machine AB compound pouring machine

PGB-1200 2 part epoxy silicone polyurethane auto glue potting machine epoxy resin dispensing machine AB compound pouring machine

Videos

Whatsapp +86 134 2516 4065 PGB-1200 2 part epoxy silicone polyurethane auto glue potting machine epoxy resin dispensing machine AB compound pouring machine                                                     Model:PGB-1200 PGB-1200 system accurat

Guangzhou Daheng Automation Equipment Co.,LTD

Events Calendar: epoxy via (1)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Jobs: epoxy via (1)

SMT Manufacturing Engineer - 2nd Shift

Career Center | Houston, Texas USA | Engineering,Management,Production

SMT Manufacturing Engineer – 2nd Shift Hunting Innova is a Houston based company serving industrial, energy, medical, defense and aerospace segments of the Electronic Manufacturing Services (EMS) Industry since 1989.  Hunting Innova is located in N

Hunting Innova

Career Center - Resumes: epoxy via (1)

Jerry McBeth Resume

Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development

Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting

Express Newsletter: epoxy via (189)

Partner Websites: epoxy via (311)

PCD Volumetric Dispensing for Epoxy,Thermal Grease,Underfill

GPD Global | https://www.gpd-global.com/co_website/news-events-pr-490.php

PCD Volumetric Dispensing for Epoxy,Thermal Grease,Underfill   Home   Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader

GPD Global

PCB Libraries Forum : VIA Guidance Request From Tim C.

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_via-guidance-request-from-tim-c_topic538.xml

PCB Libraries Forum : VIA Guidance Request From Tim C. PCB Libraries Forum : VIA Guidance Request From Tim C. This is an XML content feed of

PCB Libraries, Inc.


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