New Equipment | Industrial Automation
GE FANUC DS3800NDAC1D1E new and Original USA 1 year warranty CONTACT US: EMAIL:sales2@amikon.cn WEB:www.amikong.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791 Amikon supplys automation spare parts and control systems (DC
New Equipment | Industrial Automation
GE FANUC IC693CMM321 new and Original USA 1 year warranty CONTACT US: EMAIL:sales2@amikon.cn WEB:www.amikong.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791 Amikon supplys automation spare parts and control systems (DCS, P
Electronics Forum | Wed Apr 19 11:54:32 EDT 2000 | Rudolf Niebling
You need a KIC profiler whitch is able to find optimal profiles for your boards. The KIC works very well with the Heller ovens. With the KIC is also possible to find one good profile for different boards. Get in contact with KIC +1-858-673-6050
Electronics Forum | Tue Apr 18 19:37:35 EDT 2000 | Russ Cutler
Let me be more specific about my dilema. We have used a vapor phase reflow process for many years. We just bought a Heller 1800 this year (2000). We may very well be able to run all 600 very different board types we build in 10 recipies on the Hel
Industry News | 2011-07-14 11:02:39.0
The SMTA announced that the AIMS Harsh Environments Symposium will be held on October 17, 2011 as a focused symposium at SMTA International in Ft. Worth, TX.
Industry News | 2013-01-17 11:15:42.0
One of the “cleanest” areas on the IPC APEX EXPO® show floor will be found at the IPC/NPL Cleaning and Contamination Testing Center
Technical Library | 2009-05-07 23:23:00.0
Thermal fatigue has been one of the most serious problems for solder joint reliability. Thermo-mechanical fatigue failure is considered to be closely related to micro-structural coarsening (grain/phase growth). Factors that influence the phase growth are studied and measurement methods are discussed, including the preparation of the eutectic solder sample for phase size measurement. Three categories of models used to predict grain growth in polycrystalline materials are presented. Finally, phase growth in solder during high temperature aging and temperature cycling and its use as a damage correlation factor are discussed.
Technical Library | 2017-08-10 01:23:22.0
This paper demonstrates the high frequency performance and thermo-mechanical reliability of through vias with 25 μm diameter at 50 μm pitch in 100 μm thin glass substrates. Scaling of through via interconnect diameter and pitch has several electrical performance advantages for high bandwidth 2.5D interposers as well as mm-wave components for 5G modules.
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
SMTnet Express, August 10, 2017, Subscribers: 30,696, Companies: 10,656, Users: 23,635 High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass
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Thermo Scientific Precision Econotherm Laboratory Oven ID_001788 (8/22): World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159 CALL US
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/fr-FR/divisions/efd/products/controllers-and-control-systems/processmate-temperature-controllers
Systèmes de Maintien en Température ProcessMate Nordson EFD. Ces contrôleurs de process, simples à intégrer, maintiennent une température précise pendant la dépose afin de préserver les propriétés des produits thermo-sensibles, y compris les
