Industry Directory: equations (2)

BotFactory

Industry Directory | Manufacturer

The Future of Electronics is here - With Squink at your Desktop, print and assemble PCBs in minutes instead of weeks for less than a cup of coffee. Go from CAD design to PCB without the pain and cost.

I Technical Services

Industry Directory |

ITS is a pure electronics contract manufacturing and assembly company. We offer continuing leadership in both manufacturing technology and process improvement.

New SMT Equipment: equations (7)

Electro Static Dissaptive (ESD) Packaging

Electro Static Dissaptive (ESD) Packaging

New Equipment |  

Schaefer manufacturer's Returnable Packaging and Material Handling Containers using ESD HDPP Resins. The result is superior Electronic Component Protection in the 10'7 ~ 10'9 ohm range. This revolutionary product is only 1~2% carbon based, which eq

Schaefer Systems International

Fundamentals of MEMS Design & Fabrication

New Equipment |  

Next Scheduled Public Courses: July 17, 2008 ~ San Francisco, CA September 19, 2008 ~ Dallas, TX November 6, 2008 ~ San Jose, CA This introductory course is designed to educate people from any background on the exciting new technologies and mark

PTI Seminars, Inc.

Electronics Forum: equations (147)

Td and Tg

Electronics Forum | Wed Aug 27 17:50:48 EDT 2008 | blnorman

I know, but somewhere I read about an equation or relationship that takes both into account to generate another number.

Siemens S25 X-axis counting error

Electronics Forum | Wed Sep 30 20:53:27 EDT 2020 | emeto

Motor and motor driver are involved in the equation as well.

Used SMT Equipment: equations (5)

Tektronix TDS5104

Tektronix TDS5104

Used SMT Equipment | In-Circuit Testers

Tektronix TDS5104 1 GHz, 5 GS/s, 4 Channel Digital Phosphor Oscilloscope The TDS5000 Series digital phosphor oscilloscopes deliver up to 1 GHz bandwidth, 5 GS/s real-time sample rate, 8 MB record length and 100,000 wfms/s maximum waveform captu

Test Equipment Connection

Tektronix TDS5104

Tektronix TDS5104

Used SMT Equipment | In-Circuit Testers

Tektronix TDS5104 1 GHz, 5 GS/s, 4 Channel Digital Phosphor Oscilloscope The TDS5000 Series digital phosphor oscilloscopes deliver up to 1 GHz bandwidth, 5 GS/s real-time sample rate, 8 MB record length and 100,000 wfms/s maximum waveform captu

Test Equipment Connection

Industry News: equations (47)

NEMI's Test Strategy Project Releases Cost Model

Industry News | 2003-05-22 08:54:17.0

Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies

SMTnet

Newly Updated IPC-AJ-820A Provides Nitty-Gritty of Electronics Assembly and Soldering

Industry News | 2012-03-21 17:42:19.0

For many designers and manufacturing personnel in the electronics manufacturing supply chain, IPC-AJ-820, Assembly and Joining Handbook, is the document of choice for all aspects involved in creating a PCB.

Association Connecting Electronics Industries (IPC)

Technical Library: equations (4)

A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism

Technical Library | 2019-12-26 19:13:52.0

Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration.In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB.

Beihang University

Package-on-Package (PoP) Warpage Characteristic and Requirement

Technical Library | 2021-12-16 01:48:41.0

Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging.

Intel Corporation

Videos: equations (3)

Electrovert's  DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind.  The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.  This

Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave. This

Videos

Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.

ITW EAE

Armoire de stockage CMS - Europlacer LZERO 3 (French)

Armoire de stockage CMS - Europlacer LZERO 3 (French)

Videos

Présentation lors du salon ENOVA Paris 2014

EUROPLACER

Training Courses: equations (1)

Guide to Modern Electronics Manufacturing

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

Events Calendar: equations (1)

Avoiding the Most Common PCB Failure Modes

Events Calendar | Thu Aug 20 00:00:00 EDT 2020 - Thu Aug 20 00:00:00 EDT 2020 | ,

Avoiding the Most Common PCB Failure Modes

Surface Mount Technology Association (SMTA)

Express Newsletter: equations (9)

Partner Websites: equations (17)

Axial Component Lead Former

GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-User-Guide-801-1-07.pdf

illustrates a horizontal flush-mount component on a printed circuit board. The values for component elements A, B, and C are defined by equations in each following form calculations section. If you want to form this component, perform the calculations in

GPD Global


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