Electronics Forum | Tue Jul 10 16:13:52 EDT 2007 | bk
Hi folks, I've been bouncing off of MyData > technical support for some time on an issue with > a MyData machine. Seems that this My9 likes to > skip an 0402 placement at a rate of ~ > 1000/million. > > Profile: MyData > My9 Mechanical ce
Electronics Forum | Wed Nov 16 14:44:31 EST 2011 | olddog
Bobpan, thank you for your speedy response. As to the items you noted: 1. I did a test of Funct 30 for the first 5 nozzles, 2 times each as follows: noz1 Ht=215 & 219, center=1005 (all nozzles all tests), run out 2.2 & 2.7. Noz2 Ht=228 &228, runout=
Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam
| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run
Electronics Forum | Tue Mar 04 11:47:58 EST 2003 | msivigny
Hello John, Your second statement is a little vague about the 16th card shutting down the line with the 2x240 QFPs misplaced... i'll try to interpret, assuming the cards are actual product, which I think they are, your 16th card failed because 2 out
Electronics Forum | Tue Apr 18 06:15:49 EDT 2006 | JH
AJ, I have had the Solder Saver on trial a couple of times and reached the same conclusion both times - it is not for us. However there are benifits for some users. In case you dont know how it works, here is a brief explanation; The hand held to
Electronics Forum | Tue May 19 10:23:06 EDT 1998 | Mike C
| Howdy Richard, | Welcome to the club! I now dub thee a full fledged member of the "Spotty Gold Finger and Bleeding Ulcer Society"...or SGFBUS for short... (GRIN) | I know it's not funny to be in that position, but there's so many different places t
Electronics Forum | Mon May 18 22:15:20 EDT 1998 | Steve Gregory
Howdy Richard, Welcome to the club! I now dub thee a full fledged member of the "Spotty Gold Finger and Bleeding Ulcer Society"...or SGFBUS for short... (GRIN) I know it's not funny to be in that position, but there's so many different places to pick
Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette
This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha
