Core Capabilities � PCB Fabrication � PCB Assemblies � Box Builds � Assembly from kitted inventory � Parts procurement and guaranteed assembly � Turnkey manufacturing � Conformal coating � Wire & Mechanical Assembly Value Added Capabilities �
ECD's SmartDRY™ desiccant dry cabinet, for surface mount technology (SMT) components storage, intelligently controls moisture sensitive level (MSL) to the J-STD-033 Specification while mitigating electrostatic discharge (ESD) at low relative humidity
Career Center | Orange County, California USA | Quality Control
Job Description: Summary: Reporting to the COO/CTO the VP of Quality role will involve creating and/or augmenting the Quality system and programs to be a pro-active vs. a reactive structure. This will involve creating an overall quality vision, se
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
Industry News | 2008-12-09 09:03:44.0
By customer demand, ACL Incorporated's long-lasting static dissipative coating called Staticide ESD Safety Shield is now available as an aerosol spray.
Industry News | 2011-02-26 16:00:45.0
Essemtec AG announces that its Tower Automatic Storage System simplifies logistics and increases the flexibility of production for Variosystems, an international electronics manufacturing subcontractor
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Technical Library | 2024-06-19 15:23:54.0
Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension. Component reliability was evaluated after extended storage to assure component solderability, MSL stability and die surface integrity. Packing materials were evaluated for customer use parameters as well as structural integrity and ESD properties. Results show that current packaging material (mold compound and leadframe) is sufficiently robust to protect the active integrated circuits for many decades and permit standard reflow solder assembly beyond 15 years. Standard packing materials (bags, desiccant, and humidity cards) are robust for a 32 month storage period that can be extended by repacking with fresh materials. Packing materials designed for long term storage are effective for more than five years.
Used SMT Equipment | Screen Printers
COMPLETE FACTORY CLOSURE This MPM UP2000 HiE will be sold to the highest bidder along with other assets on December 1st. Please visit www.xlineassets.com for complete details. Also Included In Same Sale: 2015 Europlacer iiNEO I Pick and Plac
Used SMT Equipment | Pick and Place/Feeders
LIKE NEW - lightly used 2015 pick and place system. Please see www.xlineassets.com for more details. COMPLETE FACTORY CLOSURE Pre-auction offer will be considered. www.xlineassets.com Also included in same auction: 2015 Europlacer iiNEO I
