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Essemtec to Showcase HLX8100 at Productronica 2007

Industry News | 2007-11-01 01:55:45.0

Essemtec will display HLX8100, a high-performance placement system for flexible SMT manufacturing, in booths A5-277 and A5-278 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.

ESSEMTEC AG

ESSEMTEC to Introduce More Placement Efficiency with FLX2010-BLV at APEX 2008

Industry News | 2008-02-29 16:13:23.0

Glassboro, NJ � Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will debut the FLX2010-BLV SMD pick-and-place system in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

ESSEMTEC AG

Essemtec Wins the 2017 NPI Award for Multifunction Placement for the New FOX2

Industry News | 2017-02-21 15:59:49.0

Essemtec announces that it has been awarded a 2017 NPI Award in the category of Component Placement – Multifunction for its FOX2. The award was presented to the company during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. This marks the 15th industry award that the Swiss manufacturer has received in recognition of its production systems for electronic assembly and packaging. The new FOX2 by Essemtec combines jetting of solder paste or glue and placement in a single machine. The new version is based on the original award-winning platform, which is the first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments.

ESSEMTEC AG

Introducing - The Fox Pack – State-of-the-art Expandable Placement and Dispensing from Essemtec

Industry News | 2020-04-23 11:07:52.0

Essemtec announces that its FOX2 smart-sized modular pick-and-place technology is expandable in any direction. The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.

ESSEMTEC AG

ESSEMTEC Wins a 2011 NPI Award for Its Cobra SMT Assembler

Industry News | 2011-04-20 20:22:38.0

Essemtec announces that it has been awarded a 2011 NPI Award in the category of Component Placement – Multi-function for its Cobra. The award was presented to the company on a Tuesday, April 12, 2011 ceremony that took place at the Mandalay Bay Resort & Convention Center in Las Vegas during IPC APEX 2011.

ESSEMTEC AG

Essemtec to Debut New Placement Machine for Small and Mid-Size Production at APEX 2008

Industry News | 2008-02-29 18:12:49.0

Glassboro, NJ � Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will premier the PANTERA-XV SMD placement system in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

ESSEMTEC AG

ESSEMTEC to Debut New Placement Machine for Small and Mid-Size Production at APEX 2008

Industry News | 2008-03-12 16:25:33.0

Glassboro, NJ � Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will debut the PANTERA-XV SMD placement system in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

ESSEMTEC AG

New placement machine for small to middle-sized production volumes from ESSEMTEC at NEPCON China 2008

Industry News | 2008-04-07 19:21:29.0

Essemtec is to showcase the new PANTERA�XV SMD placement machine in distributor -------- booth ------ at the upcoming NEPCON China/EMT China 2008 exhibition and conference - scheduled to take place April 8-11, 2008 in Shanghai, PR China.

ESSEMTEC AG

Workshop: Three-Dimensional Arrangement of LEDs

Industry News | 2013-08-27 19:40:03.0

Due to technical progress with LEDs, ever more luminous semiconductors are coming onto the market.

ESSEMTEC AG

Essemtec to Show All-in-One High Speed Assembly / Dispensing Platform at APEX

Industry News | 2018-01-24 21:20:30.0

Essemtec today announced plans to exhibit in Booth #3525 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company will present a large all-in-one platform that can be used for the assembly of high-speed applications, rapid prototyping and high-speed dispensing. With different modules, the system can grow synchronously with customer requirements for performance and processes. The company also will demonstrate the compact Spider jet dispenser and two FOX² systems – one with the solder paste Jet valve and one with the micro screw valve.

ESSEMTEC AG


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