Industry News | 2011-04-20 20:22:38.0
Essemtec announces that it has been awarded a 2011 NPI Award in the category of Component Placement – Multi-function for its Cobra. The award was presented to the company on a Tuesday, April 12, 2011 ceremony that took place at the Mandalay Bay Resort & Convention Center in Las Vegas during IPC APEX 2011.
Industry News | 2013-08-13 12:54:43.0
The market requires highest flexibility from electronics manufacturers.
Industry News | 2020-04-23 11:07:52.0
Essemtec announces that its FOX2 smart-sized modular pick-and-place technology is expandable in any direction. The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.
Industry News | 2014-06-24 06:41:49.0
Essemtec’s high-speed Paraquda SMD pick-and-place system and Fino semi-automatic screen printer have recently been installed at the high-end consumer audio company, AVM-TEC, based in Denmark. The company is a small business specialising in top of the range OEM modules, DIY module based plug & play systems and Pre & Power-amp One amplifiers under the brand name Alluxity.
Industry News | 2015-04-06 12:41:41.0
Essemtec AG, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit at booth #7.135 at SMT/HYBRID/PACKAGING, scheduled to take place May 5-7, 2015 in Nuremberg. Company representatives will demonstrate the latest generation of Paraquda pick-and-place system and Scorpion dispensing system. Other highlights will be the new SMT storage device Cubus Large and the new highly flexible and cost-effective pick-and-place system Lynx.
Industry News | 2001-12-20 09:01:19.0
The new automatic pick&place system CSM7000 from ESSEMTEC is a precise machine for the assembly of SMD components onto printed circuits
Industry News | 2011-03-02 17:28:40.0
Essemtec announces that it will feature a range of new equipment in Booth #773 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2021-11-05 08:37:11.0
Essemtec received a 2021 GLOBAL Technology Award in the category of Mexico Technology Innovation Award for its Fox / Puma with Archerfish Solder Paste Jet Dispensing Solution. The award was announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.
Industry News | 2008-09-08 03:46:39.0
Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it has worked with leading suppliers of die bonders to develop a highly economical solution for the efficient placement of special components on film or flex boards, providing many benefits to the users.
Industry News | 2008-11-18 17:22:43.0
Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.
