Industry News | 2013-06-10 09:32:32.0
Used machines from Essemtec are difficult to obtain on the market, although there is high interest. There are good reasons for this.
Industry News | 2008-09-30 22:07:25.0
Essemtec, the leading Swiss manufacturer of highly flexible production systems for electronics, announces that it has opened a new customer training center in Suzhou, China. Automatic and semiautomatic SMD production equipment is installed for demos, education and evaluation.
Industry News | 2008-05-18 01:14:27.0
Essemtec AG, a leading manufacturer of surface mount technology production equipment, now closes the last gap in the placement stage of surface mount devices. The new option, FLX-CVU, verifies the electrical characteristics of components directly in the placement machine, ensuring unsurpassed placement reliability and product quality.
Industry News | 2008-04-17 15:39:50.0
Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces a software upgrade for its existing CLM/FLX-Series placement systems that results in more power.
Industry News | 2009-04-21 13:02:34.0
Essemtec Switzerland has announced that as of April 2009, its new subsidiary Essemtec Benelux will be responsible for all activities of the Swiss SMT equipment supplier regarding Belgium, Netherlands and Luxembourg. The first official presentation will be at the Electronics & Automation exhibition in Utrecht (27th � 29th of May 2009).
Industry News | 2008-08-14 14:51:51.0
Essemtec announces that it has developed a special twin vacuum table for its placement machine FLX2011-MKL that eases the handling of flex boards and film substrates and doubles productivity.
Industry News | 2010-09-29 23:17:20.0
Cobra is one of the most modern SMD pick-and-place systems in the world. Latest drive and material technologies combined with quick changeover concepts make it an extremely reliable, fast and flexible workhorse for both high-volume and high-variety production.
Industry News | 2012-03-30 13:42:24.0
New technologies such as package on package (PoP) component assembly or bare die assembly on COB applications, as well as the optimization of material consumption demands for increased knowledge of the actual placement forces.
Industry News | 2013-04-10 11:48:47.0
Essemtec, announces that it will exhibit numerous flexible Swiss-made solutions in Booth 7, Hall 211 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2011-03-01 16:21:16.0
In November 2010, Essemtec Switzerland founded its new central office for the Asian market in Singapore. Essemtec Asia will operate as a regional hub that coordinates customer requests with the local business partners throughout Asia.