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Henkel's New Wafer Backside Coating� Portfolio Revolutionizes Die Attach Processes

Industry News | 2008-08-01 00:29:58.0

With the well-respected die attach brands of Hysol� and Ablestik�, Henkel has long been recognized for consistently pushing the bar higher when it comes to advanced semiconductor materials development. This pioneering philosophy has led to the development of yet another groundbreaking materials advance and the launch of Henkel's Ablestik 8000� Wafer Backside Coating� (WBC) technology.

Henkel Electronic Materials

Henkel Launches Breakthrough Self-filleting Die Attach Technology

Industry News | 2008-12-06 02:17:55.0

Further advancing the capabilities of modern die attach technology, Henkel has developed and made commercially available a line of new Ablestik� brand die attach materials known as self-filleting die attach. The new class of die attach products offers all of the benefits of traditional die attach pastes, but takes the adhesive technology further by incorporating a self-filleting mechanism, making it a viable and much less costly alternative to die attach films.

Henkel Electronic Materials

Innovation Wins Big at APEX: Henkel R&D Commitment Results in Impressive Awards Haul

Industry News | 2009-04-09 22:35:29.0

The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever.

Henkel Electronic Materials

Henkel Appoints Jim Wise to Lead Global Sales Efforts for Electronics Assembly Business

Industry News | 2009-05-20 19:48:38.0

In a move designed to further expand the company's market and sales leadership, Henkel Corporation has selected Mr. Jim Wise to direct the global sales effort for its electronics assembly business.

Henkel Electronic Materials

Henkel Launches Next-Gen Underfill that has it All

Industry News | 2009-05-26 18:16:29.0

In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.

Henkel Electronic Materials

Multicore LF700 Solder Paste from Henkel Offers Exceptional Lead-free, Halide-free Performance

Industry News | 2009-06-02 14:13:36.0

With the majority of the electronics industry fully on board with lead-free manufacturing, solder paste materials requirements are now moving beyond basic functionality and toward more advanced, truly enabling capabilities.

Henkel Electronic Materials

Henkel Launches New High-Temp Compatible Conductive Film for RF Grounding Applications

Industry News | 2009-06-08 23:35:30.0

Advancing the performance of electrically conductive film technology, Henkel has developed and launched Emerson & Cuming� CF3366�, a ground-breaking film technology that offers a robust alternative to traditional conductive materials.

Henkel Electronic Materials

New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue

Industry News | 2009-07-28 12:23:26.0

In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.

ASM Assembly Systems (DEK)

New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue

Industry News | 2009-07-30 21:06:08.0

In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.

Henkel Electronic Materials

Henkel’s Pioneering Ablestik® Self-Filleting® Die Attach Receives Notice that First Patent to Grant

Industry News | 2009-09-09 20:07:33.0

Henkel Corporation today announced that the United States Patent and Trademark Office (USPTO) has allowed a patent covering its Ablestik® Self-Filleting® die attach products and controlled flow technique, which have been designed and perfected by the company over the past five years.

Henkel Electronic Materials


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