9개 존을 갖춘 무보이드 진공 리플로우 솔더링 오븐. 균형적 흐름 기술이 있는 무보이드 / 진공 리플로우 솔더링 질소 시스템 9개의 탑 및 바텀 가열 존 - 업계 최고의 직선형 피트당 최고의 존 수! 100인치 가열 길이 - 고처리율 제공! 2개의 내부 냉각 존 - 최저 출구 온도 제공! 총 길이 180인치 - 바닥면적 활용 최적화! 10인치 모듈의 새로운 모듈 디자인이 프로파일을 보다 작은 세그먼트로 세분화할 수 있는 유연성을
Technical Library | 2019-05-24 09:22:59.0
There is a smaller process window and a much narrower margin of error when creating and using lead-free reflow profiles for surface mount parts on printed circuit boards (PCBs). Solder balls, dewetting, tombstones, voids, and head-on-pillow problems will occur much more frequently because lead-free alloys behave differently than eutectic pastes. Problems are compounded due to the extra heat necessary for some lead-free pastes to reach their melting points.
9개 존을 갖춘 무보이드 진공 리플로우 솔더링 오븐. 균형적 흐름 기술이 있는 무보이드 / 진공 리플로우 솔더링 질소 시스템 9개의 탑 및 바텀 가열 존 - 업계 최고의 직선형 피트당 최고의 존 수! 100인치 가열 길이 - 고처리율 제공! 2개의 내부 냉각 존 - 최저 출구 온도 제공! 총 길이 180인치 - 바닥면적 활용 최적화! 10인치 모듈의 새로운 모듈 디자인이 프로파일을 보다 작은 세그먼트로 세분화할 수 있는 유연성을
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Technical Library | 2019-10-21 09:58:50.0
An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).
New Equipment | Solder Materials
I.C.T | Antioxidant Silver Soldering Tin Lead Free Solder Bar for Solder Wave ❙ Introduction I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that delive
Industry News | 2008-03-07 11:47:13.0
Minneapolis**, MN*� The Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition that took place January 22-24, 2008 in Kauai, Hawaii was a great success. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Industry News | 2014-01-21 18:29:32.0
SMTA and Chip Scale Review magazine, co-organizers of the International Wafer-Level Packaging Conference (IWLPC), announced the Best of Conference papers from the event held November 5-7, 2013 in San Jose.
