New Equipment | Solder Materials
With a composition of 62% Tin / 36% Lead / 2% Silver, Kapp Electric Eutectic is a cost effective eutectic electrical/electronic solder where Lead is permissible. Silver increases the strength and vibration resistance of the joint in higher stress app
New Equipment | Solder Materials
Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solde
Electronics Forum | Fri Oct 08 08:26:03 EDT 1999 | Carol Zhang
| | | I have a board, 4 spacers needed to be soldered on the board | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, ther
Electronics Forum | Thu Oct 07 16:57:02 EDT 1999 | Glenn Robertson
| | I have a board, 4 spacers needed to be soldered on the board | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, there wi
Industry News | 2010-04-23 18:53:17.0
Indium Corporation announces the signing of a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits, Inc.
Industry News | 2008-09-08 18:17:57.0
Essemtec's new stencil printer SP003-ML-V is a highly reliable system aimed at small and medium production volumes. Control of print quality and correction of print position is made easy and fast using the integrated vision system.
Parts & Supplies | Pick and Place/Feeders
CM402 / CM602 ·8mm KXFW1KS5A00 with sensor KXFW1KSBA00 without sensor ·12/16mm KXFW1KS6A00 with sensor KXFW1KSCA00 without sensor ·24/32mm KXFW1KS7A00 with sensor KXFW1KSDA00 without sensor ·44/56mm KXFW1KS8A00 with sensor
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
Technical Library | 2021-08-25 16:34:37.0
As the traditional eutectic SnPb solder alloy has been outlawed, the electronic industry has almost completely transitioned to the lead-free solder alloys. The conventional SAC305 solder alloy used in lead-free electronic assembly has a high melting and processing temperature with a typical peak reflow temperature of 245ºC which is almost 30ºC higher than traditional eutectic SnPb reflow profile. Some of the drawbacks of this high melting and processing temperatures are yield loss due to component warpage which has an impact on solder joint formation like bridging, open defects, head on pillow.
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• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
SMTnet Express, October 17, 2013, Subscribers: 26325, Members: Companies: 13458, Users: 35281 Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging by L.C. Tsao; National Pingtung University of Science
SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/high-temp-soldering/
. The act of implementing HMP solder will require soldering temperatures that are higher than standard Sn/Pb eutectic solders. Manufacturers soldering at high temperatures need to be aware of a few simple rules to prevent catastrophic component or board failures
Heller Industries Inc. | https://hellerindustries.com/reflow-oven-1912exl
Used Reflow Oven For High Volume PCB Assembly - Heller Home » Used Reflow Oven For High Volume PCB Assembly Used 1912EXL Reflow Oven Reflow Oven Model: 1912EXL DOM
