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Industry Directory | Equipment Dealer / Broker / Auctions
Auctioneers, Evaluators & Liquidators. From individual machines to complete facility closings, C3 has been around for 70 years providing value to the secondary marketplace. Find out more about us at www.C3.com.
Industry Directory | Consultant / Service Provider / Manufacturer
Since 1986, our focus on delivering quality PCB's and Assemblies hasn't changed. Our top priority has always been to understand what the customer values, evaluate their needs and deliver the best-in-class service and products.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
New Equipment | Education/Training
This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more. Students will be introduced to the proper techniques for SMT & PTH compon
Electronics Forum | Wed Dec 29 12:27:39 EST 2010 | davef
Flux evaluation * J-STD-004, Requirements for Soldering Fluxes * IPC-A-610, Acceptability of Electronic Assemblies
Electronics Forum | Tue Dec 28 07:45:19 EST 2010 | costache
Hello all! I will have un flux evaluation very soon ( lead free, leaded, water base, solvent base), so if somebody do this already can tell me something about this, there is un evaluation list with what I shod fallow or check list at the end? Thanks
Used SMT Equipment | General Purpose Test & Measurement
Ando AQ6317C Optical Spectrum Analyzer. Passes self test - no option. Advanced for a wide range of applications, including light source evaluation, measurement of loss wavelength characteristics in optical devices, and waveform analysis of WDM (Wavel
Used SMT Equipment | SMT Equipment
Product name: σ - F8 high-end module chip mounter Product number: σ - F8 Products in detail σ - F8 features Implement turret head support 1 head pasted on a variety of components. Fully realize fast, general motors, and high availability 4 bea
Industry News | 2003-06-16 09:12:35.0
Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces
Industry News | 2003-06-18 07:56:46.0
The IPC-9850 test materials kit includes all the materials needed for manufacturers to test flexible placement machines and chip shooters to the specifications of the IPC-9850 standard.
Parts & Supplies | Pick and Place/Feeders
THREE-PHASE-TACHO EVALUATION S-27 HM
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Parts & Supplies | SMT Equipment
02101356-01 SLIDING DISC FOR STAR 02101363-01 *SUBSTITUTE=00310282 UNIMOLY GLP2 25GR. 02101364-01 STOP PLATE 11x7,4 F.STROKE SLIDE 02101365-01 STOP PLATE 13 X 9 FOR STROKE SLIDE 02101366-01 *SUBSTITUTE=02313244 SP-HEAD SEGM.HC (1 02101394-01 *S
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
MIRTEC is pleased to announce that after an extensive evaluation BOSCH has selected MIRTEC’s 3D AOI Technology as the best solution to meet their ongoing quality initiatives. The evaluation process was exceedingly detailed and included a
Training Courses | | | IPC-7711/7721 Trainer (CIT) Recert.
The Certified IPC-7711/7721 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-7711/7721 Trainer (CIS) training.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Huntsville Chapter Technical Meeting: Evaluating Conformal Coatings
Events Calendar | Tue Sep 22 00:00:00 EDT 2020 - Tue Sep 22 00:00:00 EDT 2020 | Eden Prairie, Minnesota USA
Risk Analysis in Electronic Assemblies
Career Center | Marietta, GA 30066, Georgia USA | Engineering
Digital Electrical Engineer BSEE with at least 8 years experience in digital circuit design. Responsibilities include providing digital circuit design hands-on expertise relative to communication circuitry, AGC circuitry, gate arrays, microprocesso
Career Center | Dallas, Texas USA | Engineering
Responsibilities:Development and maintenance od a standardized product routing structure. Development and maintenance of product time standards. Evaluation, improvement and maintenance of the engineering quotation process for new products. Develop
Career Center | , British Columbia Canada | Maintenance
I have 10 years experience in a number of SMT focused plants. I have overseen the relocation of three plants and the installation of all related equipment.
Career Center | Timisoara, timis Romania | Engineering,Maintenance,Technical Support
Working as a service engineer at ICCO EMT for more than 10 years experience in service activities in Eastern Europe for pick and place systems from Assembleon starting 2000 in all major EMS sites, beginning 2006 involved in evaluation (first system o
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Return to Front Page THE LABORATORY A PRIMARY EVALUATION AND QUALIFICATION FACTOR TO DETERMINE PCB SUPPLIER PROCESS CAPABILITIES Earl
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_request-for-beta-evaluation-users_topic2625.xml
PCB Libraries Forum : Request for Beta Evaluation Users PCB Libraries Forum : Request for Beta Evaluation Users This is an XML content feed of
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/1836.html
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