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WHMA 27th Annual Wire Harness Conference to Offer Workshop on the Evolution of IPC’s Cable and Wire Harness Documents

Industry News | 2019-10-30 18:25:26.0

Robert Cooke, NASA aerospace engineer and electronics industry subject matter expert, will deliver a technical education workshop, “The Evolution of IPC’s Cable & Wire Harness Documents: IPC-D-620, IPC/WHMA-A-620 and IPC-HDBK-620 at the WHMA 27th Annual Wire Harness Conference, February 18, 2020, in Las Vegas, Nevada.

Association Connecting Electronics Industries (IPC)

Symposium on Counterfeit Parts and Materials

Events Calendar | Tue Jun 26 00:00:00 EDT 2018 - Thu Jun 28 00:00:00 EDT 2018 | College Park, Maryland USA

Symposium on Counterfeit Parts and Materials

Surface Mount Technology Association (SMTA)

IPC Issues New Report, The Evolution of Factories on the Future: What You Need to Know

Industry News | 2022-12-14 12:18:42.0

IPC recently convened a roundtable of electronics executives to discuss trends driving the industry's migration to the factory of the future. The executives came to a shared conclusion that the transition to the factory of the future features many challenges and pitfalls but making the transition will be increasingly critical to any company seeking to compete in the global economy. A summary of the discussion is now available: "The Evolution of Factories of the Future: What You Need to Know."

Association Connecting Electronics Industries (IPC)

Spectrum II - Solder Paste Dots & Lines

Spectrum II - Solder Paste Dots & Lines

Videos

With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su

ASYMTEK Products | Nordson Electronics Solutions

Yamaha Modular PCB Chip Shooter

Videos

Yamaha Σ-G5SⅡ Premium Modular PCB Chip Shooter ❙ Features of Yamaha PCB Chip Shooter High-efficiency SMT pick and place machine, Yamaha chip shooter, Yamaha module type mounting system with combine high productivity,, high

Dongguan Intercontinental Technology Co., Ltd.

Hutchins Grant Award Winner Announced

Industry News | 2014-11-25 17:04:36.0

During the 2014 Annual Meeting at SMTA International, the SMTA announced that Christine Taylor, a graduate student at Georgia Institute of Technology, has been selected as the recipient of the 2014 Charles Hutchins Educational Grant. The SMTA Grant Committee selected her project entitled "Nano- and Micro-scale Strain Sensors for Measuring Stress Evolution in Microelectronic Packages."

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC)

Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA

International Wafer-Level Packaging Conference (IWLPC)

Surface Mount Technology Association (SMTA)

Wafer-Level Packaging Symposium

Events Calendar | Tue Feb 15 00:00:00 EST 2022 - Thu Feb 17 00:00:00 EST 2022 | San Jose, California USA

Wafer-Level Packaging Symposium

Surface Mount Technology Association (SMTA)

Wafer-Level Packaging Symposium

Events Calendar | Wed Feb 14 00:00:00 EST 2024 - Fri Feb 16 00:00:00 EST 2024 | San Francisco, California USA

Wafer-Level Packaging Symposium

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Concludes Successfully

Industry News | 2011-11-08 15:31:27.0

The SMTA and Chip Scale Review magazine are pleased to announce the 8th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success.

Surface Mount Technology Association (SMTA)


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