Used SMT Equipment | In-Circuit Testers
Anritsu MD8480C W-CDMA (UMTS) Signaling Tester with HSPA Capability The MD8480C W-CDMA Signaling Tester has been specifically designed for developing and testing 3GPP user equipment (UE) and application software. Supporting W-CDMA, HSPA, HSPA E
Used SMT Equipment | In-Circuit Testers
Anritsu MD8480C W-CDMA (UMTS) Signaling Tester with HSPA Capability The MD8480C W-CDMA Signaling Tester has been specifically designed for developing and testing 3GPP user equipment (UE) and application software. Supporting W-CDMA, HSPA, HSPA E
The Vitronics Soltec XPM3 product platform is the latest evolution in a long history of reflow systems that have proven their capability worldwide and established a reputation for superior reliability. Robust design combined with a unique heat transf
Pragmax is a Collaborative Product Content Management system which provides quick and error-free solutions to some time-consuming problems faced by electronic hardware design teams: parts information management (electronic, mechanical and even intang
Pragmax is a Collaborative Product Content Management system which provides quick and error-free solutions to some time-consuming problems faced by electronic hardware design teams: parts information management (electronic, mechanical and even intang
The latest evolution in FAYb laser markers, the LP-V10 features super high speed marking capability, more accurate marking, deeper marking and higher definition marking on tiny objects. �Ehigh speed 12 Watt FAYb laser, 710 characters per second outpu
Events Calendar | Wed Jun 20 00:00:00 EDT 2018 - Sat Jun 23 00:00:00 EDT 2018 | Bangkok, Thailand
Manufacturing Expo 2018
Technical Library | 1999-05-07 08:55:49.0
Failure analysis (FA) is one of the key competencies in Intel. It enables very rapid achievement of world class manufacturing standards, resulting in excellent microprocessor time-to-market performance. This paper discusses the evolution of FA techniques from one generation of microprocessors to another.
Technical Library | 2007-04-04 11:43:41.0
The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.
Technical Library | 2016-04-21 14:10:55.0
The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. Traditional printed circuit boards utilize the x/y plane and many miniaturization techniques apply to the x/y space savings, such as smaller components, finer pitches, and closer component to component distances.This paper will explore the evolution of 3D assembly techniques, starting from flexible circuit technology, cavity assembly, embedded technology, 3 dimensional surface mount assembly, etc.
