Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
Technical Library | 2017-02-28 12:39:50.0
During the last 5 years mobile phones and other portable consumer electronics have been extremely popular and spread all over the world in different climate zones in very high volumes. At the same time the mobile phone terminal for many people has become a necessity that is brought with them in any activity they practice. These changes in user behavior have heavily changed the impact on handheld terminals from moisture, sweat, corrosive atmospheres and mechanical drop. As a result of this the requirement to solder joint reliability, corrosion stability and wear resistance are heavily increasing to keep a high reliability of the terminal.Immersion Ni/Au has been the overall dominant surface finish on Printed Wiring Boards (PWB's) for the last 10 years, but a paradigm shift to avoid use of this thin and porous surface finish is ongoing nowadays because it can’t address these challenges in a satisfactory way.In today's handheld terminals, Organic Solder Preservative (OSP) has replaced Immersion Ni/Au on solder pads. Carbon surface finish for Key- and spring contact-pads, combined with the right concept design can make use of Immersion Ni/Au unnecessary in the near future. The result will be higher reliability with less expensive and simpler processes.This paper will discuss the various considerations for choice of surface finish and results from the feasibility studies performed.
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz SMU200A-B10-B13-B14-B15-B16-B17-B31-B90-B106-B203-K40-K41-K62 Rohde Schwarz SMU200A/ B10/B13/B14/B15/B16/B17/B31/B90/B106/B203/K40/K41/K62 The R&S SMU200A Vector Signal Generator not only combines up to two independent signal ge
The SolderStar PRO thermal profiling systems include our latest evolution of ultra-compact datalogger featuring the unique SolderStar ‘SmartLink’ connector system. The thermal profiler unit is docked into a protective heat shield and thermocouple ada
Industry News | 2012-05-22 14:14:12.0
ACD,announced the purchase of a PDR IR-E3 Evolution 2000 BGA Rework System for ultimate performance in BGA rework.
Industry News | 2022-08-26 08:47:00.0
PDR is pleased to introduce its new Integrated Solder Past Print Part System for rework. The tools are designed to work with all PDR Evolution Series Rework Systems.
Industry News | 2018-10-17 20:09:44.0
PDR announces that it was awarded a 2018 Global Technology Award in the category of Repair & Rework for its IR-E6 Evolution XL rework system. The award was presented to the company during a Tuesday, Oct. 16, 2018 ceremony that took place during SMTA International.
Industry News | 2019-01-05 08:00:24.0
PDR today announced plans to exhibit at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will introduce the PDR IR-E6S Evolution in Booth #1519. The new IR-E6S with Auto Lift will be available in February 2019.
Industry News | 2021-11-22 07:29:17.0
PDR is pleased to announce that it received a 2021 GLOBAL Technology Award in the category of Rework & Repair Equipment for its IR-E6 Evolution XL rework system. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 during productronica in Munich, Germany.