Industry News | 2021-03-25 15:48:41.0
The SMTA Officer team is excited to provide our members with a new webinar by Dr. Nathan Blattau, R&D Fellow at Ansys, Inc., on "Next Generation Lead Free Solders for High Reliability and SMT Yield improvement in Client Computing Systems." The webinar will be on Tuesday, April 6th at 12:00 PM EST and will discuss the evolution of lead free (Pb-free) solder, from tin-silver-copper (SAC) system with silver content of 3.0 and 4.0 to low SAC solders and the emergence of high reliability Pb-free solder. It will cover the reasons and the driving forces of industries implementing this change.
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Wed Apr 28 00:00:00 EDT 2021 - Wed Apr 28 00:00:00 EDT 2021 | ,
Continued Journey of Equality Expo
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Industry News | 2002-03-27 09:42:31.0
Glenn Woodhouse and Janet Semmens were named winners of the Best of Conference Awards
Industry News | 2008-12-06 02:08:39.0
Anaheim, CA � The SMTA is pleased to announce the 2009 SMTA Anaheim Academy program. SMTA Anaheim will be held February 10-11, 2009 at the Anaheim Convention Center in conjunction with Electronics West. This year's program will feature six half-day Courses led by leading instructors in the industry.
Industry News | 2021-08-13 12:11:05.0
The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2022 in San Jose, CA, USA. The theme of the event is "Advanced Packaging: The Dawn of a New Era." The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements.
Industry News | 2023-08-01 06:13:48.0
Industrial control applications play a vital role in modern manufacturing processes, ensuring precision, efficiency, and reliability in diverse industries. Two significant electronic assembly technologies, Surface Mount Technology (SMT) and Through-Hole Technology (THT), have long been used independently in the manufacturing sector. However, with the continuous evolution of technology, the integration of SMT and THT industries has emerged as a powerful trend, driving innovation, and offering new possibilities for industrial control applications. In this article, we will explore the synergies between SMT and THT, showcasing how their combination enhances industrial control solutions, making manufacturing processes smarter, faster, and more versatile.
Industry News | 2010-08-17 14:08:36.0
The SMTA and Chip Scale Review magazine are pleased to announce six half-day tutorials for the 7th Annual International Wafer-Level Packaging Conference.
Industry News | 2011-06-29 16:19:46.0
SMTA and CALCE @ University of Maryland are pleased to announce the west coast venue for the Symposium on Counterfeit Electronic Parts and Electronic Supply Chain. The program will be held December 6-8, 2011 at the Crowne Plaza Anaheim Resort in Anaheim, California. Abstracts are now being accepted through August 23, 2011.
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