Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Industry News | 2018-09-04 15:51:06.0
YINCAE is excited to announce that we have developed SMT 158HA, an underfill with zero outgassing that is fully compatible with flux material.
Industry News | 2024-05-13 10:19:11.0
SHENMAO Technology is pleased to offer its PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. PF606-P276 has been specifically developed for the surface mount technology (SMT) process, offering superior void performance after the reflow process. By minimizing gas generation during reflow, this solder paste ensures exceptional reliability and performance for a wide range of electronic components and assemblies.
Industry News | 2018-10-18 09:21:56.0
RECENT SELECTIVE SOLDERING INDUSTRY TRENDS
Industry News | 2016-02-29 09:18:03.0
Inventec introduces new enhanced co-solvent, Topklean EL20P for challenging refluxing applications, To learn more about Topklean EL20P you can visit Inventec at IPC Apex exhibition, booth 1863.
Industry News | 2006-04-17 11:14:44.0
Indium Corporation�s NF260 No-Flow Underfill was awarded the 2006 EM Asia
Industry News | 2019-03-12 08:54:28.0
(Albany, NY) March 12, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS New England Symposium & Expo 2019, at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA. Additionally, Dr. Wusheng Yin, President of YINCAE, will be giving a presentation on our unique product, Zero Outgassing and Flux Residue-compatible Underfill.
Industry News | 2023-04-24 19:16:05.0
SHENMAO America, Inc. is proud to announce the release of its new product, the UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV. This innovative new solder paste is designed to meet the demands of modern electronics manufacturing, offering excellent performance and reliability.
Industry News | 2023-01-09 18:39:37.0
With its rule-breaking wave solder alloy, SN100C, Nihon Superior Co., Ltd. earned global recognition as an innovator in lead-free solder formulation. The rule that SN100C broke was that you can't make a Pb-free solder without a silver content that doubles the cost of the raw materials. Now Nihon Superior has broken that rule again with SN100CV, a reflow soldering alloy that can outperform SAC305 in reliability while being reflowable with the same thermal profile as SAC305.
