>>CONTACT NOW Email: at@mooreplc.com Mobile: +8618020714662 Skype: +8618020714662 >>>CONTACT NOW Product Description ABB Type Designation:DSDX 454 Catalog Description:DSDX 454 Remote In / Out Basic Unit Long Description:DSDX 454 Re
>>CONTACT NOW Email: at@mooreplc.com Mobile: +8618020714662 Skype: +8618020714662 >>>CONTACT NOW Product Description Product ID:57360001-HG ABB Type Designation:DSMB 127 Catalog Description:DSMB 127 Memory Board,RWM with Battery L
>>CONTACT NOW Email: at@mooreplc.com Mobile: +8618020714662 Skype: +8618020714662 >>>CONTACT NOW Product Description Product ID:57360001-HX ABB Type Designation:DSMB 176 Catalog Description:DSMB 176 Expansion Board for PROM module
>>CONTACT NOW Email: at@mooreplc.com Mobile: +8618020714662 Skype: +8618020714662 >>>CONTACT NOW Product Description Product ID:57360001-HC ABB Type Designation:DSMC 112 Catalog Description:DSMC 112 Floppy Disk Controller Lo
>>CONTACT NOW Email: at@mooreplc.com Mobile: +8618020714662 Skype: +8618020714662 >>>CONTACT NOW Product Description Product ID:57310001-MP ABB Type Designation:DSPC 172H Catalog Description:DSPC 172H Processor Unit Long Des
Technical Library | 2015-01-08 17:26:59.0
Regardless of the accelerating trend for design and conversion to Pb-free manufacturing, many high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products. Certain high reliability electronic products from the telecommunication, military, and medical sectors manufacture using SnPb solder assembly and remain in compliance with the RoHS Directive (restriction on certain hazardous substances) by invoking the European Union Pb-in-solder exemption. Sustaining SnPb manufacturing has become more challenging because the global component supply chain is converting rapidly to Pb-free offerings and has a decreasing motivation to continue producing SnPb product for the low-volume, high reliability end users. Availability of critical, larger SnPb BGA components is a growing concern
Technical Library | 2015-07-01 16:51:43.0
Aerospace and military companies continue to exercise RoHS exemptions and to intensively research the long term attachment reliability of RoHS compliant solders. Their products require higher vibration, drop/shock performance, and combined-environment reliability than the conventional SAC305 alloy provides. The NASA-DoD Lead-Free Electronics Project confirmed that pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under dynamic loading. One possible route to improvement of the mechanical and thermo-mechanical properties of solder joints is the use of Pb-free solders with lower process temperatures. Lower temperatures help reduce the possibility of damaging the boards and components, and also may allow for the use of lower Tg board materials which are less prone to pad cratering defects. There are several Sn-Ag-Bi and Sn-Ag-Cu-Bi alloys which melt about 10°C lower than SAC305. The bismuth in these solder compositions not only reduces the melting temperature, but also improves thermo-mechanical behavior. An additional benefit of using Bi-containing solder alloys is the possibility to reduce the propensity to whisker growth
Technical Library | 2017-01-05 16:55:11.0
The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later, all major OEM and Tier 1 automotive manufacturers have converted or are in the process of converting to lead free circuit assembly processing. Starting with SAC (SnAgCu) alloys as a baseline for lead free soldering, in the last years several specific alloys were developed in order to improve resistance to high temperature creep, vibration survival and the ability to withstand thermal cycling and thermal shock.The paper compares three different solder alloys and two flux chemistries in terms of void formation and mechanical / thermal fatigue properties. Void content and reliability data of the alloys will be presented and discussed in relation to the acceptance criteria of a Tier 1 /OEM automotive supplier. As a result, a ranking list will be presented considering the combined performance of the alloys. In order to analyze the void formation and mechanical behavior of different solder alloys and flux chemistry combinations, statistical methods are used.
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
Industry News | 2001-02-26 09:09:45.0
Royal Philips Electronics is launching a USD 2.5 billion Global Commercial Paper Program (CP Program). Under this Program, Philips will issue commercial paper notes ("Notes") worldwide, which will be sold through a number of dealers. With maturities up to 365 days, it will provide an additional and flexible financing source, which Philips will use for general corporate purposes.
