Electronics Forum | Thu May 06 08:29:41 EDT 2004 | Christopher Lampron
10% RH) Do these stored components need baking before I use them now or not? * Depends on the MSD level (should be marked on packaging) Level 6 component need to be baked prior to asembly no matter what. Other levels should be OK if they were store
Electronics Forum | Wed Jul 04 11:10:56 EDT 2001 | davef
It�s tough to say. You need enough, but you can�t have too much because you slop it all over the pads, but if you have too little � well you get the picture. There�s so many ways to get to the same place. There is no standard. It�s whatever you n
Electronics Forum | Fri May 22 13:20:33 EDT 1998 | Earl Moon
| | | Does anyone know about low pressure/low temperature | | | ovens used for baking of moisture senstive | | | components? | | | Thanks | | I need to know from where your need came. I usually just bake in conventional ovens with specified times a
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
Electronics Forum | Wed May 05 14:37:58 EDT 2004 | Gaz
I'm not in production, but I do repairs by replacing CSP & LGA components on PCB's. Our components are supplied sealed in packs of 5 with a humidity indicator card and desiccant. I recently failed an audit by the company I do the work for because th
Electronics Forum | Thu Sep 11 15:23:31 EDT 2003 | Peter L.
I have come across a rash of failed assemblies that have 0805 capacitors and resistors, bottom side glued, wave soldered and washed. Trouble shooter reported touching up the solder joints on a few areas and the boards would pass test. I had a look a
Electronics Forum | Wed May 16 18:52:14 EDT 2007 | ratsalad
cman, I wrote a macro for "TextPad" which is free to download for a fully functional evaluation (which never expires). The macro converted my sample Mentor neutral file to this format: ############################################# ###Component I
Electronics Forum | Fri Mar 26 09:00:19 EDT 2010 | krish_bala
Thank you Graham for the response. The particular BGA that we currently Bake is a Level 3 BGA, which means the BGA will expire in 7 days after removal. We are currently baking the BGAs once a week for the problem described above. These devices are u
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
