Full Site - : exploded solder-joint bga (Page 4 of 82)

IPC Seeking Volunteers for 2003 Annual Meeting and Technical Conference

Industry News | 2003-04-17 11:32:31.0

Taking place Sept. 28-Oct. 2, at the Minneapolis Convention Center in Minneapolis, Minn.

Association Connecting Electronics Industries (IPC)

I.C.T | High-end Multiple AOI Inspection solutions

Industry News | 2022-12-02 10:54:48.0

AOI AI Core Technolog Applying deep learning algorithms in the field of industrial inspection, big data optimized, intelligent minimalist programming, one-click automatic identification of trained components and solder joints, intelligent judgment of bad.

Dongguan Intercontinental Technology Co., Ltd.

Technical Papers Take Top Honors at IPC APEX EXPO Winning Papers to be Presented at Technical Conference

Industry News | 2013-02-14 08:18:47.0

IPC – Association Connecting Electronics Industries® has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2013

Association Connecting Electronics Industries (IPC)

SMTA China Presents Best Paper/Presentation Awards & Best Exhibit Awards at SMTA China

Industry News | 2014-09-18 17:55:32.0

SMTA China announcing that it presented awards for nine papers at the SMTA China South 2014 Conference Award Presentation Ceremony, held on Tuesday, August 26, 2014 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2015-06-17 14:05:18.0

The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open. The conference will be held at the Donald Stephens Convention Center in Rosemont, Illinois on September 27 - October 1, 2015. This year's program allows the attendee to choose from 19 courses, 120 technical papers, three focused symposia, and numerous complimentary offerings throughout the conference and exhibition

Surface Mount Technology Association (SMTA)

Long-term Volunteer Dave Hillman Inducted into IPC Hall of Fame

Industry News | 2018-03-01 19:13:43.0

In recognition and acknowledgement of his extraordinary contributions to IPC and the electronics industry, Dave Hillman, Rockwell Collins, was presented with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO on Tuesday, February 27 at the San Diego Convention Center. IPC’s most prestigious award, the Hall of Fame is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.

Association Connecting Electronics Industries (IPC)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2018-06-26 20:35:35.0

The SMTA is pleased to announce that the program and registration for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai. Taking place October 14-18, 2018 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.

Surface Mount Technology Association (SMTA)

Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas

Industry News | 2011-01-20 13:45:14.0

IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.

Association Connecting Electronics Industries (IPC)

IPC Conference on Reliability Highlights New Findings in All Areas of Electronics Assembly

Industry News | 2011-08-24 17:13:21.0

The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.

Association Connecting Electronics Industries (IPC)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)


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