Electronics Forum | Fri Nov 14 09:51:43 EST 2014 | jpal
Rock can contain a little bit of moisture. Bake the rocks for a long time before placing them in solder so they don't explode. The glass marbles may be the safest idea. Or start heating the tank with the solid mass already in there. Did I just write
Electronics Forum | Tue Jul 28 02:28:48 EDT 1998 | Bob Willis
The causes for solder on gold are: Paste wash offs Dirty stencils Dirty under stencil cleaning cloths/no solvent Poor handling The most common reason is wash offs when there is a couple of balls left on the tabs and they reflow. With correct profile
Electronics Forum | Mon Apr 30 09:25:40 EDT 2001 | davef
I�m sorry. I missed the announcement that designated you are the arbiter of the appropriateness, maturity, and professionalism of this forum. I think you will have a difficult time with your company if you explode in a childish rant like this every
Electronics Forum | Wed Nov 10 17:39:34 EST 1999 | Dave Vulcano
Hello, Looking for some insight. We just finished a run and experienced a lot of solder balls. We used a no clean paste, nitrogen atmosphere reflow oven, and saw the solder balls on 1206 - 0805 chip components. All of the solder balls appeared and
Electronics Forum | Thu Nov 11 14:55:23 EST 1999 | Dave F
Dave: I think you�re correct. The solder balls are probably from either: � Excessive paste � OR � Paste "exploding/popping" during reflow � OR � Some other variable. Two things: 1 It�s virtually impossible to determine the cause of your ball gen
Electronics Forum | Thu Oct 21 11:32:15 EDT 1999 | John Thorup
Larry Elaborating on the specific question, yes, the volatile solvents in the flux can and will evaporate. Evaporate completely in any reasonable amount of time? Probably not. What tends to happen is that the exposed paste dries on the surface and
Electronics Forum | Fri Feb 24 04:16:02 EST 2006 | rlackey
Hi Russ, We had a painted/waxed floor in one factory & a ESD tiled floor in the other. Both passed every audit (including telecoms & Japanese OEM's)that tested ESD etc. Neither factory had issues with ESD damage to components either. The tiled f
Electronics Forum | Thu Nov 30 08:09:19 EST 2006 | INGE
Hi everybody, The matter is this: after reflow, on top side leads of chip components (resistor 0805)appear some empty balls of solder. In some cases this thing is only on the lead and the solder joint seems good, in other cases this empty ball is als
Electronics Forum | Wed Apr 04 19:31:57 EDT 2007 | rgduval
Dave, We're reworking with flux and solder. We're observing "exploding" joints, as well...as though something is trapped in the joints (either excess flux not burning off during solder, or residual moisture). As mentioned above, I spoke with the f
Electronics Forum | Mon Nov 19 09:04:21 EST 2007 | rgduval
We determined moisture more as a diagnosis based on omission. We eliminated the other variables, noted that the parts were cracking in reflow, and deducted that it was trapped moisture. As the moisture expands, the component can be cracked/destroye
