Industry News | 2009-04-23 20:39:41.0
NASHVILLE � April 2009 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it has won a remarkable six awards on two continents during the last year.
Industry News | 2017-09-26 19:24:28.0
BTU International today announced that it will exhibit at Heat Treat, ASM’s Heat Treating Society Conference & Exhibition, scheduled to take place October 24-26, 2017 in Columbus, Ohio. BTU will highlight its controlled atmosphere furnaces in Booth #2524.
Industry News | 2016-08-09 19:59:05.0
Saline Lectronics, Inc., a leading electronics contract manufacturer, recently installed the Stinger on its DEK Horizon 03iX printer used on a high-volume SMT Line. The company plans to add the Stinger to its other DEK printers in the future.
Industry News | 2021-10-21 05:22:55.0
Insituware LLC is pleased to announce Charlie Kempner as its new North American Sales Manager.
Industry News | 2021-10-13 13:02:30.0
BTU International, Inc. today announced plans to exhibit during productronica 2021, scheduled to take place Nov. 16-19, 2021 at Neue Messe München in Munich, Germany. The company will showcase its Aqua Scrub™ Flux Management Technology and a PYRAMAX™ 125A with its representative STRATUS VISION Gmbh in Hall A3, Stand 441.
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
Technical Library | 2024-07-24 01:04:35.0
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O pads; (3) reduced lead inductance; and (4) good thermal and electrical performance due to the adoption of exposed copper die-pad technology. These features make the QFN an ideal choice for many new applications where size, weight, electrical, and thermal properties are important. However, adoption of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. It is well known that the presence of voids will affect the mechanical properties of joints and deteriorate the strength, ductility, creep, and fatigue life. In addition, voids could also produce spot overheating, lessening the reliability of the joints.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2018-10-18 11:13:35.0
PCB Outline Layer And Keep-out Polygon Clearance
Industry News | 2018-10-18 08:55:30.0
Nitrogen Protection Reflow Oven
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
