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HYDRON® SE 230A

HYDRON® SE 230A

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Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro

ZESTRON Americas

KappAloy9 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

KappAloy9 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

New Equipment | Solder Materials

KappAloy9™ - 91%Sn - 9%Zn - 390°F (199°C) eutectic alloy is the best solder for soldering Aluminum wire to Copper busses or soldering Copper wire to Aluminum busses or contacts. Its low eutectic melting point minimizes heating of critical electrical/

Kapp Alloy & Wire, Inc

Intermetallic Growth in Tin-Rich Solders

Technical Library | 2017-06-13 17:14:59.0

For tin-rich solder alloys, 200 C (392 F) is an extreme temperature. Intermetallic growth in tin-copper systems is known to occur and is believed to bear a direct relationship to failure mechanisms. This study of morphological changes with time at elevated temperatures was made to determine growth rates of tin-copper intermetallics. Preferred growth directions, rates of thickening, and notable changes in morphology were observed.Each of four tin-base alloys was flowed on copper and exposed to temperatures between 100 C and 200 C for time periods of up to 32 days. Metallographic sections were taken and the intermetallics were examined. Intermetallic layer thickening is characterized by several distinct stages. The initial growth of side plates is extremely rapid and exaggerated. This is followed by retrogression (spheroidization) of the elongated peaks and by general thick-

General Electric

HANDY & HARMAN

New Equipment |  

Reel-to-reel plating; Wire bondable Gold, Silver, Copper, Nickel,...

West-Tech Materials

Signal Transmission Loss due to Copper Surface Roughness in High-Frequency Region

Technical Library | 2015-04-30 20:17:03.0

Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So, signal transmission loss of copper wiring on a printed circuit board has been studied. First, total signal loss was divided into dielectric loss and conductor loss quantitatively based on electromagnetic theory. In particular, the scattering loss due to surface roughness of copper foil has been examined in detail. And the usefulness of the copper foil with low surface roughness has been demonstrated.

Mitsui Kinzoku Group

KappZapp3.5 - Tin Silver Solder for Stainless Steel to Stainless Steel and Copper

KappZapp3.5 - Tin Silver Solder for Stainless Steel to Stainless Steel and Copper

New Equipment | Solder Materials

Low melting temperatures prevent loss of properties and minimize distortion on thin wires and sheets. KappZapp3.5™ Tin-Silver alloys are used for electronics, fabrication, ducting, food containers, storage bins, instruments, Copper plumbing pipe, and

Kapp Alloy & Wire, Inc

What's usage of Via tenting for PCB design?

Industry News | 2019-11-05 22:07:01.0

Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.

Headpcb

Nihon Superior Wins 2020 IPC APEX EXPO Innovation Award for New Flux-Cored Solder Wire

Industry News | 2020-02-06 03:57:56.0

Nihon Superior Co. Ltd. was awarded an IPC APEX EXPO 2020 Innovation Awardon Tuesday, Feb. 4, 2020 during the opening keynote.

Nihon Superior Co., Ltd.

Z-Crown Group International Ltd.

Industry Directory | Manufacturer

Z-Crown Group Network Co., Ltd. is located in Shenzhen city, Guangdong Province, China. It's a professional networking products manufacture.Producing & processing Cables ,Accessories,Equipments. Main

AFX YOKOGAWA

AFX YOKOGAWA

New Equipment | Industrial Automation

General Precautions: 1. Precaution during Transportation    The magnetic flowmeter is packed tightly. When it is unpacked, pay attention to prevent damaging the flowmeter. To prevent accidents while it is being transported to the installing locatio

Wuhan Xieyuan Automation Equipment Co., Ltd


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