New Equipment | Industrial Automation
General Precautions: 1. Precaution during Transportation The magnetic flowmeter is packed tightly. When it is unpacked, pay attention to prevent damaging the flowmeter. To prevent accidents while it is being transported to the installing locatio
Technical Library | 2021-05-26 00:53:26.0
This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster, smaller and higher performance communication and electronic devices, build-up technology incorporating microvias has emerged as a viable multilayer printed circuit manufacturing technology. Increased wiring density, reduced line widths, smaller through-holes and microvias are all attributes of these High Density Interconnect (HDI) packages. Filling the microvias with conductive material allows the use of stacked vias and via in pad designs thereby facilitating additional packaging density. Other potential design attributes include thermal management enhancement and benefits for high frequency circuitry. Electrodeposited copper can be utilized for filling microvias and provides potential advantages over alternative via plugging techniques. The features, development, scale up and results of direct current (DC) and periodic pulse reverse (PPR) acid copper via filling processes, including chemistry and equipment, are described.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
New Equipment | Solder Materials
KappZapp3.5™ is the most popular of the low temperature Silver bearing solders. It melts completely at just 430°F (221°C). This minimizes the heat applied to your sensitive electronic parts and minimizes distortion of thin wire or tabs. Learn more
Molex's membrane switches provide durable, lightweight and low-profile options for integrating user interfaces and electronic components into a variety of applications including medical, industrial and commercial products. Molex standard membrane s
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
Industry Directory | Manufacturer
An established machine shop to fabricate for all your needs..Jigs, Fixtures, Mold & Die Parts, Tooling, Machined Parts & etc in precision & semi-precision. We also provide production CNC machining & wire EDM services.
Since 1979 we have marketed a variety of Auto-Electrical Wiring Products.We sell Cable Ties, Solderless Terminals, Primary Wire, Split Loom, Spiral Wrap, Fuse and Fuseholders, Copper Lugs, Scotchloks,Grommets, Wire Nuts, Speaker Wire, 3M Electrical
Technical Library | 2020-11-29 22:06:45.0
Plastic laminates are increasingly used as interposers within chip packaging applications. As a component within the package, the laminate is subjected to package moisture sensitivity testing. The moisture requirements of chip packaging laminates are related to ambient moisture absorption and thermal cycling. Printed wiring board (PWB) laminates, however, are gauged on properties relating to wet processes such as resist developing, copper etching, and pumice scrubbing. Consequently, printed wiring board moisture absorption test methods differ from chip packaging test conditions.
Since 1982 CSP has been providing copper and fiber optic cable assemblies for the OEM, CATV and telecommunications markets. We specialize in extremely complex cable assemblies. CSP is an ISO9001 company in Minneapolis, Minnesota. 1-800-4-CABLES
