Full Site - : exposed pad tqfp (Page 13 of 21)

100% solder coverage

Electronics Forum | Fri Sep 14 09:30:29 EDT 2007 | russ

That is inherent issue with lead free, you may want to ask your customer to reconsider this specification, It was probably initiated during the pb days when an exposed pad could signify a reflow issue. Overprinting will give you solderballs and unle

LED lifted soldering defect

Electronics Forum | Wed Dec 04 10:59:04 EST 2019 | dwl

The solder looks a little grainy for Sn/Pb solder but that might just be the picture quality. There appears to be plenty of solder on the pads, so I'd rule out anything to do with the stencil. One possibility that springs to mind; how long is your

omit stencil apertures to hand solder or paste, reflow then solder.

Electronics Forum | Tue Feb 25 06:06:11 EST 2020 | hexton

I am currently weighing up my options for resistors that will be fitted to a fully assembled PCB (PTH&SMT). Do I omit the stencil apertures leaving exposed pads (ENIG) so they can be hand soldered with fresh solder. Considering shelf life for soldera

Re: Bare Copper Pad Reflow Soldering

Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon

| | I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | | This ceramic su

Re: bare board problem

Electronics Forum | Thu Jun 17 19:40:11 EDT 1999 | Scott Cook

| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an

Re: bare board problem

Electronics Forum | Thu Jun 17 19:40:27 EDT 1999 | Scott Cook

| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an

Re: bare board problem

Electronics Forum | Thu Jun 17 19:41:29 EDT 1999 | Scott Cook

| | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads.

Combining two similar footprints - absolute no, or might work - tips to improve odds?

Electronics Forum | Mon Apr 14 17:38:18 EDT 2014 | bradlevy

I've got a small smt board I've already got working prototypes of, which uses a tactile switch. I've got another much less expensive tact switch of similar size that I had avoided due to a difference in actuators I originally had no way around. Now I

Micro Leadless Frame - solder wetting control

Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan

Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet

via capping

Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef

SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting


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