Lite Fast SR-1000, a UV Solder Mask, was designed to screen print over conductive traces, landing pads, resistors, fuses and capacitors on Printed Circuit Boards (PCBs) and ceramic substrates. Other applications include metal and various plastics.
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2008-06-30 14:17:39.0
LOS ALAMITOS, CA � June 30, 2008 � Practical Dummy Components is now supplying the Amkor FusionQuad�, representing a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad� QFP and MLF� technologies.
Left: This part looked ok to the naked eye. Right: A microscopic view shows evidence of this part being previously soldered or reworked. Another part caught and prevented from being a potential problem for our customer. Decapsulation, Pinpri
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
Design For Manufacturability And Yield Enhancement. The Design for Manufacturability (DFM) engine searches for fabrication issues and discovers areas where yields may be increased. GraphiCode's Contour Technology produces fast and accurate results f
Industry News | 2018-11-27 14:03:14.0
Super PCB is pleased to announce that it offers a variety of quality PCB surface finishes. PCB surface finish is the coating between the PCB and components that provides a solderable surface for components and protects the exposed copper circuitry.
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Industry News | 2015-04-07 17:14:44.0
KYZEN announces that David Lober presented during the recent SMTA Intermountain Expo at Boise State University. Mr. Lober presented “Improving Device Reliability When Building Highly Dense Assemblies.” For more than 25 years KYZEN consistently has delivered leading science connected to care in order to persistently create the most effective cleaning solutions for each customer’s unique manufacturing process or problem. Mr. Lober is part of KYZEN’s innovative new product technology team.
