Electronics Forum | Tue Mar 10 21:40:27 EST 1998 | Carl mitchell
| I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles mak
Electronics Forum | Wed Apr 07 22:15:31 EDT 2004 | davef
We're not familiar with the AUG5 from Taiyo. [It doesn't show on their US site.] Is it liquid photoimageable? Printed solder masks are more likely to bleed. But you wouldn't have any solderability with bleed. Your plating seems acceptable [if th
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Fri Jun 18 10:46:10 EDT 1999 | Scott Cook
| | | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads
Electronics Forum | Mon Feb 15 15:33:47 EST 1999 | Earl Moon
| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc | I'm sure you know all the basic differences as Tg, X, Y, and Z expansi
Electronics Forum | Fri Jun 18 13:48:37 EDT 1999 | Earl Moon
| We currently use HASL on all of our boards and I would like to move to something else. I have sampled some boards with Entek OSP and I loved it, the problem is we have plated mounting holes on just about every board we make. Does anyone have info
Electronics Forum | Thu Apr 15 10:05:50 EDT 2010 | dwonch
Hi all, Long story ahead.... We are having issues with board vendors on some of our higher layer count (thick) boards. Specifically under BGAs with high aspect ratio vias (14:1). We are using ENIG finish and a lead free process. Basically we get t
Electronics Forum | Thu Nov 16 12:31:36 EST 2000 | Stefan Witte
Hi Willem, you may be better off to study the archives of Universities. I know that at least the Universities in Berlin, Munich and Georgia Tech here in Atlanta are studying the manufacturing process on SMT lines. I was once exposed to a quite compli
Electronics Forum | Sat Aug 22 17:01:31 EDT 1998 | Earl Moon
| | | Board shops and us, the user, have a lot on our hands. As far as getting traces - this is done using an etch resist before solder mask and the HASL processes are performed. | So when in the process is HASL performed?? | | | With tin/lead pla
Electronics Forum | Mon Aug 24 07:12:44 EDT 1998 | Tryin'
What conditions make Earl Moon say "damn, why can't XXX get the HASL right? Just look at this crummy board. Get a RMA No. Stat." | | | Board shops and us, the user, have a lot on our hands. As far as getting traces - this is done using an etch re
