Industry News | 2011-09-14 12:04:43.0
The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
Industry News | 2008-12-15 15:28:33.0
LOS ALAMITOS, CA - December 2008 - With the wide acceptance of Amkor's FusionQuad� (VQFP/HVF-PQFP), Practical Components has added two new test boards to its lineup. FusionQuad� packages are leadframe-based plastic offering the effective integration of ExposedPad TQFP and MLF� technologies. FusionQuad� not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.
LMZM23600V3SILR 36V, 0.5A Step-Down DC/DC Power Module in 3.8mm × 3mm Package TI New and Original LMZM23600V3SILR in Stock IC 10-LDFN Exposed Pad, Module, 21+ package Today's Hot Deals： LE4271-2 TO263 INFINEON 22+ AD620ANZ DIP-8 ADI
LMZM23600V3SILR 36V, 0.5A Step-Down DC/DC Power Module in 3.8mm × 3mm Package TI New and Original LMZM23600V3SILR in Stock IC 10-LDFN Exposed Pad, Module, 21+ package Today's Hot Deals： LE4271-2 TO263 INFINEON 22+ AD620ANZ DIP-8 ADI
MLT provides laser services to remove unwanted squeeze-out from exposed metal pads, traces, and cavities. Squeeze-out can take the form of polyimide adhesives or prepreg resins. Whether a part of your standard manufacturing process or needed for re
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
