Electronics Forum | Fri Jun 10 17:55:16 EDT 2022 | jdengler
Generally we overprint on the exposed part of these pads. When there isn't enough clearance at the end of the pad we place solder preforms with the placement machine. Jerry
Electronics Forum | Mon Jul 07 11:46:29 EDT 2008 | aj
Hi All, Can anyone advise the spec for land size of a lead 0.2mm in width? I am placing a TQFP128 0.4mm pitch, the leads seem to be wider than the actual pads they are been placed on? I am also experiencing poor wetting on this part , it has NiPdAU
Electronics Forum | Tue Dec 05 15:10:55 EST 2000 | Francois Monette
Victor, here are a few more elements of information to answer your question. Both the temperature and relative humidity on the manufacturing floor have a significant impact relative to the rate of diffusion of moisture inside a plastic package and t
Electronics Forum | Tue Dec 14 12:00:34 EST 1999 | Kris Wiederhold
We recently reduced our standard aperture reduction to aid in the reduction of solder on gold defects. Since this reduction in aperture size, we have been experiencing exposed copper at the end of the component pads. The heel and toe joints are per
Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F
| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl
Electronics Forum | Mon Oct 23 06:51:36 EDT 2000 | fastech6
I have a problem with solder getting into exposed gold pads. What is the best rework procedure for removing the solder and restoring the gold condition of the pad? At the moment, we are also covering the gold pad with kapton tape prior to solder
Electronics Forum | Thu Sep 16 17:56:48 EDT 2010 | asksmt
Ok Thanks, i have reduced thermal pad size by 4.5 mils on top and bottom part of this footprint where the problem was occuring, so now the clearance between thermal pad and lead pads are 12 mils instead of 7.5 mils on two sides. (i kept the signal pa
Electronics Forum | Thu Jul 19 20:08:33 EDT 2001 | Lex WW
Can anyone tell me the significance of the EPTSSOP (Exposed Pad Thin Shrink Small Outline Package)? From the drawing it appears to be just a 28-pin TSSOP. Are there any special sensitivities / requirements during PCB assembly? Please help.
Electronics Forum | Tue Jan 24 11:59:55 EST 2006 | Chunks
Tell your board house/customers you want "non-smobc". hich stands for non-solder maske over bare copper. MPMs love exposed fids in just about any finish. You can always use pads on an MPM too.
Electronics Forum | Thu Feb 21 17:19:08 EST 2008 | davemn
if you are not using them for test points or want them filled with solder for current carrying capability then tent them puppies. i was able to move our company away from exposed vias many years ago and this eliminated lots of hairline shorts between
