Industry Directory | Manufacturer
An innovative thermal management company that is dedicated to address the thermal challenges that the electronics industry is facing.
Industry Directory | Manufacturer / Manufacturer's Representative
We specialize in EMI Ferrite Core, Thermal Pads, Gaskets and shielding products.
We are well versed in the following thermal application materials: Sil-Pad thermally conductive insulators Gap-Pad thermally conductive gap filling material Q-Pad thermal grease replacement film Bond-Ply thermally conductive adh
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Electronics Forum | Tue Feb 18 19:07:21 EST 2003 | arturoflores
Our case is not due to thermal pad print squeezing because our shorts are mostly in the outer rows of the BGA so they cannot be caused by central pad printing. We still stick to the BGA thermal pad coplanarity/height hypothesis but have not yet prove
Electronics Forum | Fri Dec 27 09:45:04 EST 2002 | emeto
what exactly do you mean by big thermal pad?
Used SMT Equipment | Soldering - Selective
Pillarhouse Jade MKII Selective Soldering Machine Model: Jade MKII Year: 2016 Lead-Free Drop Jet Fluxer Top Side IR Pre-Heat Auto Soler Top-Up & Solder Level Detect Inerted Nitrogen System Thermal Nozzle Calibrati
Used SMT Equipment | Repair/Rework
Manncorp RW1210 SMT / BGA Rework Station Vintage: 2014 1.3 Million Pixel, High-Definition, Split-Vision Optics with 230x Joystick-Controlled Zoom High-Resolution 15" Full Color LCD Display for Simultaneous, Superimposed Viewing of Component Leads
Industry News | 2003-02-24 09:32:24.0
Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Parts & Supplies | SMT Equipment
ROLLER PULLEY 101130202503 for FUJI FUJI H1193W PAD VP6RSE FUJI H1193X PAD VP10LBNE FUJI H1193Y PAD VP15LBNE FUJI H1194A TO H1193A FUJI H1194B PAD KP-3.5-N-31W FUJI H1194C PAD KP-6-N-31W FUJI H1194D PAD VACUUM KP-10-N-31W FUJI H1194G PAD VAC
Parts & Supplies | Soldering Equipment/Fluxes
NXT CPU BOX SERVO AMP XB02290 SMT CPU board, system board , driver board FH1011B-0 BOARD FH1015A-0 BOARD FH1108B PC BOARD FH1119AO QP3 BOARD(PCB) FR0000465 FS-V21R-0 FU-67V-0 GFQC0020 PLATE GFQC1220 CYLINDER GFTR8220 TIMING PULLEY GFTR8
Technical Library | 2007-01-31 15:17:04.0
The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
ORION Industries | http://orionindustries.com/pdfs/thermal.pdf
. Sil-Pad , Gap Pad, and Q-Pad are registered trademarks of The Bergquist Company. One Orion Park Drive, Ayer, MA 01432 • Phone: 978-772-6000 • Fax: 978-772-0021 • E-mail: info@orionind.com • www.orionindustries.com ORION INDUSTRIES INCORPORATED GAP PADS Material Thickness Range Thermal Conductivity Gap Pad V0 Soft
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/thermal-interface-material-tim
: Offer higher thermal conductivity when compared to solid thermal pad materials Conform well to substrates filling the tiniest air gaps to improve heat transfer Reduce the risk of defects by
