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Camden Electronics Appoints New Distributor in Germany for Enclosure Products

Industry News | 2003-06-09 09:41:14.0

Mehlo Bauelemente GmbH specialises in electronic packaging and has 20 years experience serving the German market with a wide range of enclosure products.

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Richardson Electronics Expands Their Alliance with HUBER+SUHNER

Industry News | 2003-06-12 08:48:13.0

Richardson Electronics named first worldwide distributor

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Virtex-II FPGA Prototyping Boards Enable Complex FPGA Design Evaluation & Testing

Industry News | 2003-06-16 09:12:35.0

Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces

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Pulse Offers Highest Power Density SMT Planar Transformer

Industry News | 2003-01-24 09:07:53.0

For Industrial, Telecom and Datacom Use

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California Micro Devices Announces Enhanced EMI Filtering with ESD Protection for GSM Handsets

Industry News | 2003-02-25 09:10:01.0

The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.

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Adaptive Tool Prevents Components Floating Off

Industry News | 2003-06-12 08:24:37.0

An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.

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Integrated Circuit Systems, Inc. Offers Rambus Yellowstone Memory Interface Clock Generators

Industry News | 2003-06-20 08:31:58.0

Leading chip timing solutions provider manufactures fast memory interface clock generators for high-bandwidth applications

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Tin Whisker Joint Meeting Held in Tokyo

Industry News | 2003-06-23 08:49:39.0

Three Organizations from the US, Europe and Japan to

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DDI Corp. Provides Update on Negotiations with it's Senior Lenders and Convertible Noteholders

Industry News | 2003-04-04 08:46:37.0

Company Announces Further Reductions to Goodwill and Reclassifications of Indebtedness Recorded in Fiscal 2002

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Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

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