Electronics Forum | Mon Apr 06 09:04:31 EDT 2015 | jesseoliveira
Hi all! I work in FA Lab on Brazil. Recently we had a problem with a dye pry analysis of BGA component due to breakage of WLP package (wafer level packaging). In this case, WLP thickness is about 0.28mm and was damaged during pullout process. Our
Electronics Forum | Wed Aug 28 10:16:12 EDT 2002 | Jim M.
Sam We install a lot of die in the SMT room using same process as SMT parts.Water soluble solder paste is used for attachment of die to ceramic and boards. Biggest problem i found is the adjustment from installing the die in the bonding area. The t
Industry News | 2014-03-26 08:48:51.0
Seika Machinery, Inc.announces that it has been awarded a 2014 NPI Award in the category of Test & Inspection – ICT for its HIOKI FA1240 Flying Probe Tester.
Industry News | 2014-02-19 16:39:50.0
Seika Machinery, Inc.announces that it will exhibit in Booth #2433 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Parts & Supplies | Pick and Place/Feeders
937/5000 1. SMT equipment original/imitation accessories sales: Fuji, Juki, Yamaha, Samsung, Panasonic, and other equipment suction nozzle, Feida and accessories, suction Rod, Suction nozzle Rod, sensor, cutter, belt, filter cotton, sensor, light mo
Parts & Supplies | Pick and Place/Feeders
For Panasonic SMT Spare Parts TAPE FEEDER CM402/602/NPM 12MM without sensor feeder KXFW1KSCA00 FA0020M0000 Product specification: Model For Panasonic 12MM without sensor Feeder P/N KXFW1KSCA00 FA0020M0000 Condition Full New In Stock Standar
Technical Library | 2019-09-23 09:35:00.0
Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull).
SMTnet Express, March 31, 2016, Subscribers: 24,152, Companies: 14,760, Users: 39,935 EMI-Caused EOS Sources in Automated Equipment Vladimir Kraz; OnFILTER, Inc. Electrical overstress causes damage to sensitive components, including latent damage
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/FLOware-Base-Locations-Reference-Guide-22100025.pdf
. Gehen Sie nirgend- woanders in der FLO- ware® software oder die Garantie erlischt und der Kunde wird komplett fuer jeden Servicecall verant- wortlich gemacht und die dadurch entstehenden Kosten fuer die Fa. “exlorations